PROCEDIMENTO ED APPARECCHIO PER LA LACCATURA ELETTROSTATICA DI PANNELLI DI CIRCUITI STAMPATI
The invention relates to an apparatus for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the apparatus is that the printed circuit boards, continuously conveyed in a suspended position, are l...
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| creator | KLAUS GRAH WERNER SCHAUF GUNTER KORSTEN |
| description | The invention relates to an apparatus for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the apparatus is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously. |
| format | Patent |
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The characterizing feature of the apparatus is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously.</description><edition>5</edition><language>ita</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; NOZZLES ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920617&DB=EPODOC&CC=IT&NR=1235042B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920617&DB=EPODOC&CC=IT&NR=1235042B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KLAUS GRAH</creatorcontrib><creatorcontrib>WERNER SCHAUF</creatorcontrib><creatorcontrib>GUNTER KORSTEN</creatorcontrib><title>PROCEDIMENTO ED APPARECCHIO PER LA LACCATURA ELETTROSTATICA DI PANNELLI DI CIRCUITI STAMPATI</title><description>The invention relates to an apparatus for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. 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The characterizing feature of the apparatus is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| language | ita |
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| subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NOZZLES PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | PROCEDIMENTO ED APPARECCHIO PER LA LACCATURA ELETTROSTATICA DI PANNELLI DI CIRCUITI STAMPATI |
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