HEAT EXCHANGE DEVICES, LIQUID ADHESIVE SYSTEMS, AND RELATED METHODS
A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispen...
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creator | WESLEY C. FORT STEVEN CLARK MARK A. GOULD JAY LANIER LAURENCE B. SAIDMAN |
description | A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange further includes a heating element for heating the liquid adhesive material flowing through the thin slit section to the application temperature. |
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SAIDMAN</creatorcontrib><description>A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. 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The first dimension and the length are substantially greater than the second dimension. The heat exchange further includes a heating element for heating the liquid adhesive material flowing through the thin slit section to the application temperature.</description><subject>BLASTING</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD2cHUMUXCNcPZw9HN3VXBxDfN0dg3WUfDxDAz1dFFwdPFwDfYMc1UIjgwOcfUFSjj6uSgEufo4hri6KPi6hnj4uwTzMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ4Tz8jM2MjF1cfIwNDE0dj4lQBALCVLF0</recordid><startdate>20150626</startdate><enddate>20150626</enddate><creator>WESLEY C. 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FORT</creatorcontrib><creatorcontrib>STEVEN CLARK</creatorcontrib><creatorcontrib>MARK A. GOULD</creatorcontrib><creatorcontrib>JAY LANIER</creatorcontrib><creatorcontrib>LAURENCE B. SAIDMAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WESLEY C. FORT</au><au>STEVEN CLARK</au><au>MARK A. GOULD</au><au>JAY LANIER</au><au>LAURENCE B. SAIDMAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT EXCHANGE DEVICES, LIQUID ADHESIVE SYSTEMS, AND RELATED METHODS</title><date>2015-06-26</date><risdate>2015</risdate><abstract>A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange further includes a heating element for heating the liquid adhesive material flowing through the thin slit section to the application temperature.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING WEAPONS |
title | HEAT EXCHANGE DEVICES, LIQUID ADHESIVE SYSTEMS, AND RELATED METHODS |
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