A PROCESS FOR PREPARING A HEAT RECOVERABLE MOULDED HOLLOW ARTICLE COATED WITH A HEAT-CURABLE MIXTURE
Cohesive flexible curable adhesive coatings formed from a dispersion of first and second powdered curing components, preferably reactive at ambient temperatures, in a solution of a binder, the binder content being not more than 15%, preferably not more than 2.5% by weight of the dried composition. A...
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| creator | MICHAEL JOHN READ GEOFFREY PETER HANKS STEPHEN J. OSBORNE MICHAEL ROSSER READ |
| description | Cohesive flexible curable adhesive coatings formed from a dispersion of first and second powdered curing components, preferably reactive at ambient temperatures, in a solution of a binder, the binder content being not more than 15%, preferably not more than 2.5% by weight of the dried composition. Also claimed are curable compositions having a specific advantageous reactive particle size distribution; specific epoxy--amine adduct curing agents; and specific polyalkylene oxide binders. |
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OSBORNE</creatorcontrib><creatorcontrib>MICHAEL ROSSER READ</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MICHAEL JOHN READ</au><au>GEOFFREY PETER HANKS</au><au>STEPHEN J. OSBORNE</au><au>MICHAEL ROSSER READ</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A PROCESS FOR PREPARING A HEAT RECOVERABLE MOULDED HOLLOW ARTICLE COATED WITH A HEAT-CURABLE MIXTURE</title><date>1989-01-21</date><risdate>1989</risdate><abstract>Cohesive flexible curable adhesive coatings formed from a dispersion of first and second powdered curing components, preferably reactive at ambient temperatures, in a solution of a binder, the binder content being not more than 15%, preferably not more than 2.5% by weight of the dried composition. Also claimed are curable compositions having a specific advantageous reactive particle size distribution; specific epoxy--amine adduct curing agents; and specific polyalkylene oxide binders.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS DYES ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP |
| title | A PROCESS FOR PREPARING A HEAT RECOVERABLE MOULDED HOLLOW ARTICLE COATED WITH A HEAT-CURABLE MIXTURE |
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