Sealed electronic package providing in-situ metallization

In-situ adjustments to frequency characteristics of an electronic device such as a piezoelectric element (40) can be accomplished by means of a predetermined atmosphere (18) enclosed within a package comprised of a base (12) and a cover (14) and an included amount of sputterable electrode material (...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	THOMAS A. KNECHT, JOSEPH P. KRAUSE, BRIAN M. MANCINI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION OF NOISE BY SUCH CIRCUITS GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS SEMICONDUCTOR DEVICES
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