SOLDERING PASTE AND PROCESS OF COHESIVE CONNECTION

A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ≤500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80%...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TRODLER, Joerg, FRITZSCHE, Sebastian, SCHULZE, Juergen
Format:	Patent
Sprache:	eng ; hun
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!