FLOORING ASSEMBLY WITH HEAT DISSIPATION LAYER

A composite, heat dissipating panel for a compartment includes a panel made up of a first skin, a second skin positioned below the first skin, and a core encapsulated within the panel between the first and second skins and peripheral closeouts. A heat dissipation layer is provided in the panel at or...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Biddle, Andrew J, Desing, James E
Format: Patent
Sprache:hrv ; eng
Schlagworte:
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