EPOXY IMIDE COMPOSITIONS
A composition useful for making circuit boards which is the reaction product of (a) an epoxy resin or an epoxy novalac resin and optionally, a brominated epoxy resin and (b) a bismaleimide; wherein the product of (a) and (b) is subsequently reacted with a curing agent such as a diamine of the formul...
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| creator | WILLIAM FRANK GRAHAM |
| description | A composition useful for making circuit boards which is the reaction product of (a) an epoxy resin or an epoxy novalac resin and optionally, a brominated epoxy resin and (b) a bismaleimide; wherein the product of (a) and (b) is subsequently reacted with a curing agent such as a diamine of the formula H2N-R -NH2 wherein R is an aromatic, aliphatic or cycloaliphatic group. The composition is used to impregnate a fibrous substrate of fiberglass, high temperature polyamides or graphite fibers which is laminated to a copper sheet; the resulting laminate is used for form a circuit boards that have good electrical and physical properties. |
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The composition is used to impregnate a fibrous substrate of fiberglass, high temperature polyamides or graphite fibers which is laminated to a copper sheet; the resulting laminate is used for form a circuit boards that have good electrical and physical properties.</description><edition>4</edition><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>1985</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850215&DB=EPODOC&CC=HK&NR=10885A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850215&DB=EPODOC&CC=HK&NR=10885A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WILLIAM FRANK GRAHAM</creatorcontrib><title>EPOXY IMIDE COMPOSITIONS</title><description>A composition useful for making circuit boards which is the reaction product of (a) an epoxy resin or an epoxy novalac resin and optionally, a brominated epoxy resin and (b) a bismaleimide; wherein the product of (a) and (b) is subsequently reacted with a curing agent such as a diamine of the formula H2N-R -NH2 wherein R is an aromatic, aliphatic or cycloaliphatic group. 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| language | eng |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | EPOXY IMIDE COMPOSITIONS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T02%3A38%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WILLIAM%20FRANK%20GRAHAM&rft.date=1985-02-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EHK10885A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |