DIRECT CHIP ATTACH STRUCTURE AND METHOD

A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIM BENG LIAN, LAU KOK YANG, QUAH GUAN KENG, JAMES KNAPP
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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