Holding down construction for a printed circuit board
A holding down construction (100) for a printed circuit board, comprising a grid-like structure 1 comprising first ribs 10, 10a and second ribs 20 arranged in a crossed manner, wherein the first ribs and the second ribs form intersections 13, and the structure 1 has an upper side and a lower side 12...
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creator | Gergely László Hegedüs-Fuchs Tamas Attila Fodor Daniel Farkas |
description | A holding down construction (100) for a printed circuit board, comprising a grid-like structure 1 comprising first ribs 10, 10a and second ribs 20 arranged in a crossed manner, wherein the first ribs and the second ribs form intersections 13, and the structure 1 has an upper side and a lower side 12. The holding down construction further comprises screwing posts 2 attached to the structure 1 and configured to be screwed against a printed circuit board (PCB) and/or another component such as a heat sink for cooling the PCB and contact structures 3 attached to the lower side 12 of the structure and configured to lie against and exert a force against the printed circuit board , improving cooling performance and mitigating deformation of the PCB during large variations in operating temperature. |
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The holding down construction further comprises screwing posts 2 attached to the structure 1 and configured to be screwed against a printed circuit board (PCB) and/or another component such as a heat sink for cooling the PCB and contact structures 3 attached to the lower side 12 of the structure and configured to lie against and exert a force against the printed circuit board , improving cooling performance and mitigating deformation of the PCB during large variations in operating temperature.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241002&DB=EPODOC&CC=GB&NR=2628604A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241002&DB=EPODOC&CC=GB&NR=2628604A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Gergely László Hegedüs-Fuchs</creatorcontrib><creatorcontrib>Tamas Attila Fodor</creatorcontrib><creatorcontrib>Daniel Farkas</creatorcontrib><title>Holding down construction for a printed circuit board</title><description>A holding down construction (100) for a printed circuit board, comprising a grid-like structure 1 comprising first ribs 10, 10a and second ribs 20 arranged in a crossed manner, wherein the first ribs and the second ribs form intersections 13, and the structure 1 has an upper side and a lower side 12. 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The holding down construction further comprises screwing posts 2 attached to the structure 1 and configured to be screwed against a printed circuit board (PCB) and/or another component such as a heat sink for cooling the PCB and contact structures 3 attached to the lower side 12 of the structure and configured to lie against and exert a force against the printed circuit board , improving cooling performance and mitigating deformation of the PCB during large variations in operating temperature.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | Holding down construction for a printed circuit board |
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