Epoxy resin curable composition and adhesive containing same

Provided is an epoxy resin curable composition that cures quickly and has a high hardness and excellent color tone after curing. This epoxy resin curable composition, which contains an epoxy resin having two or more epoxy groups per molecule, thiol compound A having two or more thiol groups per mole...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Hiromitsu Abe, Motoharu Seo
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided is an epoxy resin curable composition that cures quickly and has a high hardness and excellent color tone after curing. This epoxy resin curable composition, which contains an epoxy resin having two or more epoxy groups per molecule, thiol compound A having two or more thiol groups per molecule, an amine compound having primary and/or secondary amino groups and thiol compound B represented by any of specific general formulae (1) to (3), is characterized in that: the thiol compound A and the thiol compound B are different from each other; and when the number of moles of the epoxy groups in the epoxy resin curable composition is regarded as Me, the number of moles of the thiol groups in the thiol compound A is regarded as MA and the number of moles of the thiol groups in the thiol compound B is regarded as MB, then the molar ratio MA/Me is 0.29-0.80 and the molar ratio MB/Me is 0.02-0.4.