Laser diode assembly and a method of assembling such a laser diode assembly
A laser diode assembly 10 comprising one or more laser diodes (optionally a long cavity, broad area, single edge type, with double heterostructure), mounted on a carrier 14. The laser diode assembly may comprise a plurality of laser diodes interconnected and arranged in series. The carrier 14 includ...
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| creator | Firooz Nasser-Faili Daniel James Twitchen |
| description | A laser diode assembly 10 comprising one or more laser diodes (optionally a long cavity, broad area, single edge type, with double heterostructure), mounted on a carrier 14. The laser diode assembly may comprise a plurality of laser diodes interconnected and arranged in series. The carrier 14 includes a heat spreader 14a for example, comprising Chemical Vapour Deposition, CVD, diamond, and a layer of solder 16 interposed between the one or more laser diodes and the carrier, the layer of solder 16 comprising silver. |
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The laser diode assembly may comprise a plurality of laser diodes interconnected and arranged in series. The carrier 14 includes a heat spreader 14a for example, comprising Chemical Vapour Deposition, CVD, diamond, and a layer of solder 16 interposed between the one or more laser diodes and the carrier, the layer of solder 16 comprising silver.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DEVICES USING STIMULATED EMISSION ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221130&DB=EPODOC&CC=GB&NR=2606993A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221130&DB=EPODOC&CC=GB&NR=2606993A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Firooz Nasser-Faili</creatorcontrib><creatorcontrib>Daniel James Twitchen</creatorcontrib><title>Laser diode assembly and a method of assembling such a laser diode assembly</title><description>A laser diode assembly 10 comprising one or more laser diodes (optionally a long cavity, broad area, single edge type, with double heterostructure), mounted on a carrier 14. The laser diode assembly may comprise a plurality of laser diodes interconnected and arranged in series. The carrier 14 includes a heat spreader 14a for example, comprising Chemical Vapour Deposition, CVD, diamond, and a layer of solder 16 interposed between the one or more laser diodes and the carrier, the layer of solder 16 comprising silver.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD2SSxOLVJIycxPSVVILC5OzU3KqVRIzEtRSFTITS3JyE9RyE-DSWTmpSsUlyZnAOVysGjjYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXx7k5GZgZmlpbGjsaEVQAAK9kz3w</recordid><startdate>20221130</startdate><enddate>20221130</enddate><creator>Firooz Nasser-Faili</creator><creator>Daniel James Twitchen</creator><scope>EVB</scope></search><sort><creationdate>20221130</creationdate><title>Laser diode assembly and a method of assembling such a laser diode assembly</title><author>Firooz Nasser-Faili ; Daniel James Twitchen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_GB2606993A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>Firooz Nasser-Faili</creatorcontrib><creatorcontrib>Daniel James Twitchen</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Firooz Nasser-Faili</au><au>Daniel James Twitchen</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laser diode assembly and a method of assembling such a laser diode assembly</title><date>2022-11-30</date><risdate>2022</risdate><abstract>A laser diode assembly 10 comprising one or more laser diodes (optionally a long cavity, broad area, single edge type, with double heterostructure), mounted on a carrier 14. The laser diode assembly may comprise a plurality of laser diodes interconnected and arranged in series. The carrier 14 includes a heat spreader 14a for example, comprising Chemical Vapour Deposition, CVD, diamond, and a layer of solder 16 interposed between the one or more laser diodes and the carrier, the layer of solder 16 comprising silver.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DEVICES USING STIMULATED EMISSION DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Laser diode assembly and a method of assembling such a laser diode assembly |
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