Module having dual side mold with metal posts

Packaged module 100 comprising a packaging substrate 102 having a first and second side. First and second components 104a, 104b, 110 are mounted on the first and second sides of the packaging substrate. First and second overmolds 106, 112 are on the first and second sides of the packaging substrate i.e., a dual-sided mold. The second overmold defines a mounting surface for mounting the packaged module on a circuit board. Conductive features 114 (e.g., metal posts) are on the second side of the packaging substrate to provide electrical connections for the packaged module. The conductive features have a sufficiently high melting temperature so that the conductive features do not melt during a mounting operation. Each conductive feature has a surface that is coplanar with or recessed with respect to the mounting surface of the second overmold. Solderable material layer 130 is dimensioned to cover the surface of each conductive feature.