Wafer with buried V-groove cavity for fiber coupling

A wafer with a buried V-groove cavity, and a method for fabricating V-grooves. In some embodiments, the method includes bonding a first layer, to a top surface of a substrate, to form a composite wafer, the first layer being composed of a first semiconductor material, the substrate being composed of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Damiana Lerose, Henri Nykänen, John Paul Drake, Janne Ikonen
Format:	Patent
Sprache:	eng
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
Online-Zugang:	Volltext bestellen
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