Fully reticulated detectors for curved focal plane arrays
A curved focal plane array (FPA) comprises an array of detectors 12, with mesas 24 etched between the detectors such that the detectors are electrically and physically isolated from each other. Metallization 26 deposited at the bottom of the mesas reconnects the detectors electrically and provides a...
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creator | Majid Zandian |
description | A curved focal plane array (FPA) comprises an array of detectors 12, with mesas 24 etched between the detectors such that the detectors are electrically and physically isolated from each other. Metallization 26 deposited at the bottom of the mesas reconnects the detectors electrically and provides a common ground between them. Strain induced by bending the FPA into a curved shape is therefore induced across the metallization and any backfill epoxy 22, rather than across the detectors. The FPA may comprise a common buffer layer 14, on which an anti-reflective coating 28 may be deposited. Indium bumps 18 may be evaporated onto respective detectors for connection to a readout integrated circuit (ROIC) 20. The ROIC coupled to the detectors is preferably thinned, and the backside of the ROIC may also include mesas such that the ROIC is reticulated. The FPA may be a HgCdTe, InGaAs, HyViSi or SLS FPA. The method of fabricating the FPA comprises forming the array of detectors on a substrate, etching mesas between the detectors, depositing metallization to reconnect the detectors, and removing the substrate. |
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Metallization 26 deposited at the bottom of the mesas reconnects the detectors electrically and provides a common ground between them. Strain induced by bending the FPA into a curved shape is therefore induced across the metallization and any backfill epoxy 22, rather than across the detectors. The FPA may comprise a common buffer layer 14, on which an anti-reflective coating 28 may be deposited. Indium bumps 18 may be evaporated onto respective detectors for connection to a readout integrated circuit (ROIC) 20. The ROIC coupled to the detectors is preferably thinned, and the backside of the ROIC may also include mesas such that the ROIC is reticulated. The FPA may be a HgCdTe, InGaAs, HyViSi or SLS FPA. 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Metallization 26 deposited at the bottom of the mesas reconnects the detectors electrically and provides a common ground between them. Strain induced by bending the FPA into a curved shape is therefore induced across the metallization and any backfill epoxy 22, rather than across the detectors. The FPA may comprise a common buffer layer 14, on which an anti-reflective coating 28 may be deposited. Indium bumps 18 may be evaporated onto respective detectors for connection to a readout integrated circuit (ROIC) 20. The ROIC coupled to the detectors is preferably thinned, and the backside of the ROIC may also include mesas such that the ROIC is reticulated. The FPA may be a HgCdTe, InGaAs, HyViSi or SLS FPA. 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Metallization 26 deposited at the bottom of the mesas reconnects the detectors electrically and provides a common ground between them. Strain induced by bending the FPA into a curved shape is therefore induced across the metallization and any backfill epoxy 22, rather than across the detectors. The FPA may comprise a common buffer layer 14, on which an anti-reflective coating 28 may be deposited. Indium bumps 18 may be evaporated onto respective detectors for connection to a readout integrated circuit (ROIC) 20. The ROIC coupled to the detectors is preferably thinned, and the backside of the ROIC may also include mesas such that the ROIC is reticulated. The FPA may be a HgCdTe, InGaAs, HyViSi or SLS FPA. The method of fabricating the FPA comprises forming the array of detectors on a substrate, etching mesas between the detectors, depositing metallization to reconnect the detectors, and removing the substrate.</abstract><oa>free_for_read</oa></addata></record> |
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title | Fully reticulated detectors for curved focal plane arrays |
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