Devices and methods related to radio-frequency filters on silicon-on-insulator substrate
A radio-frequency (RF) module comprises a wafer level chip scale package (WLCSP) mounted on a packaging substrate 172. The WLCSP has a silicon die 104 that includes a RF circuit 160 implemented at or near a first side of the die, mounting features 168 on the second side of the die, and a plurality o...
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| creator | James Phillip Young |
| description | A radio-frequency (RF) module comprises a wafer level chip scale package (WLCSP) mounted on a packaging substrate 172. The WLCSP has a silicon die 104 that includes a RF circuit 160 implemented at or near a first side of the die, mounting features 168 on the second side of the die, and a plurality of vias 108 connecting the first and second sides of the die. The WLCSP also has at least one RF flip chip 102 including a filter circuit mounted on the first side of the silicon die, in communication with the RF circuit. The height of the WLCSP is less than the height of a package where a similar silicon die and a similar number of RF flip chips are mounted next to each other on a packaging substrate. The RF module can be included in a wireless device to route a radio signal received by an antenna to a receiver. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_GB2588561A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>GB2588561A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_GB2588561A3</originalsourceid><addsrcrecordid>eNqFiz0KAjEUBrexEPUMvgukUFnZ1n8PYGG3xOQLG4h5a14ieHtT2AsD08xMm_sRb28gpKOlJ_LAVigh6AxLmSlp61m5hFdBNB9yPmQkIY4kPnjDUVV8lFIXTiTlITnVe95MnA6Cxc-zZnk-3Q5XhZF7yKgNInJ_2a_brmu3q93mf_EF7Bw6CQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Devices and methods related to radio-frequency filters on silicon-on-insulator substrate</title><source>esp@cenet</source><creator>James Phillip Young</creator><creatorcontrib>James Phillip Young</creatorcontrib><description>A radio-frequency (RF) module comprises a wafer level chip scale package (WLCSP) mounted on a packaging substrate 172. The WLCSP has a silicon die 104 that includes a RF circuit 160 implemented at or near a first side of the die, mounting features 168 on the second side of the die, and a plurality of vias 108 connecting the first and second sides of the die. The WLCSP also has at least one RF flip chip 102 including a filter circuit mounted on the first side of the silicon die, in communication with the RF circuit. The height of the WLCSP is less than the height of a package where a similar silicon die and a similar number of RF flip chips are mounted next to each other on a packaging substrate. The RF module can be included in a wireless device to route a radio signal received by an antenna to a receiver.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; RESONATORS ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210428&DB=EPODOC&CC=GB&NR=2588561A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210428&DB=EPODOC&CC=GB&NR=2588561A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>James Phillip Young</creatorcontrib><title>Devices and methods related to radio-frequency filters on silicon-on-insulator substrate</title><description>A radio-frequency (RF) module comprises a wafer level chip scale package (WLCSP) mounted on a packaging substrate 172. The WLCSP has a silicon die 104 that includes a RF circuit 160 implemented at or near a first side of the die, mounting features 168 on the second side of the die, and a plurality of vias 108 connecting the first and second sides of the die. The WLCSP also has at least one RF flip chip 102 including a filter circuit mounted on the first side of the silicon die, in communication with the RF circuit. The height of the WLCSP is less than the height of a package where a similar silicon die and a similar number of RF flip chips are mounted next to each other on a packaging substrate. The RF module can be included in a wireless device to route a radio signal received by an antenna to a receiver.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>RESONATORS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFiz0KAjEUBrexEPUMvgukUFnZ1n8PYGG3xOQLG4h5a14ieHtT2AsD08xMm_sRb28gpKOlJ_LAVigh6AxLmSlp61m5hFdBNB9yPmQkIY4kPnjDUVV8lFIXTiTlITnVe95MnA6Cxc-zZnk-3Q5XhZF7yKgNInJ_2a_brmu3q93mf_EF7Bw6CQ</recordid><startdate>20210428</startdate><enddate>20210428</enddate><creator>James Phillip Young</creator><scope>EVB</scope></search><sort><creationdate>20210428</creationdate><title>Devices and methods related to radio-frequency filters on silicon-on-insulator substrate</title><author>James Phillip Young</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_GB2588561A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>RESONATORS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>James Phillip Young</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>James Phillip Young</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Devices and methods related to radio-frequency filters on silicon-on-insulator substrate</title><date>2021-04-28</date><risdate>2021</risdate><abstract>A radio-frequency (RF) module comprises a wafer level chip scale package (WLCSP) mounted on a packaging substrate 172. The WLCSP has a silicon die 104 that includes a RF circuit 160 implemented at or near a first side of the die, mounting features 168 on the second side of the die, and a plurality of vias 108 connecting the first and second sides of the die. The WLCSP also has at least one RF flip chip 102 including a filter circuit mounted on the first side of the silicon die, in communication with the RF circuit. The height of the WLCSP is less than the height of a package where a similar silicon die and a similar number of RF flip chips are mounted next to each other on a packaging substrate. The RF module can be included in a wireless device to route a radio signal received by an antenna to a receiver.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES |
| title | Devices and methods related to radio-frequency filters on silicon-on-insulator substrate |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T16%3A05%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=James%20Phillip%20Young&rft.date=2021-04-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EGB2588561A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |