Hybrid land grid array connector for improved signal integrity

Embodiments of the present invention include a method for fabricating a hybrid land grid array connector and the resulting structures. A body is provided. The body includes a first plurality of holes and a second plurality of holes. A conductive layer is deposited on the top and bottom surfaces of t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Daniel Dreps, Sungjun Chun, Wiren Becker, Brian Beaman, Jose Hejase
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRICITY LINE CONNECTORS
Online-Zugang:	Volltext bestellen
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