MEMS devices and processes
A MEMS microphone transducer has a vent structure (201, figs 4a, b, c) provided in the membrane layer. This vent structure is provided for protecting the transducer against the sudden, large pressure differential across the membrane due to acoustic shocks and the like. An opening 410 is formed at or...
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creator | Marek Sebastian Piechocinski |
description | A MEMS microphone transducer has a vent structure (201, figs 4a, b, c) provided in the membrane layer. This vent structure is provided for protecting the transducer against the sudden, large pressure differential across the membrane due to acoustic shocks and the like. An opening 410 is formed at or within the vent structure for tuning the frequency response of the microphone. The opening provides for different flow paths to be provided as the pressure differential passes respective threshold values. A variety of different vent structures and openings are described (figs 5b to 9). |
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This vent structure is provided for protecting the transducer against the sudden, large pressure differential across the membrane due to acoustic shocks and the like. An opening 410 is formed at or within the vent structure for tuning the frequency response of the microphone. The opening provides for different flow paths to be provided as the pressure differential passes respective threshold values. A variety of different vent structures and openings are described (figs 5b to 9).</description><language>eng</language><subject>DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PUBLIC ADDRESS SYSTEMS ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180926&DB=EPODOC&CC=GB&NR=2560774A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180926&DB=EPODOC&CC=GB&NR=2560774A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Marek Sebastian Piechocinski</creatorcontrib><title>MEMS devices and processes</title><description>A MEMS microphone transducer has a vent structure (201, figs 4a, b, c) provided in the membrane layer. 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This vent structure is provided for protecting the transducer against the sudden, large pressure differential across the membrane due to acoustic shocks and the like. An opening 410 is formed at or within the vent structure for tuning the frequency response of the microphone. The opening provides for different flow paths to be provided as the pressure differential passes respective threshold values. A variety of different vent structures and openings are described (figs 5b to 9).</abstract><oa>free_for_read</oa></addata></record> |
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subjects | DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PUBLIC ADDRESS SYSTEMS TRANSPORTING |
title | MEMS devices and processes |
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