Double far-side laser ablation

The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14′) deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising: directing a first laser beam (21) through on...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	David Charles Milne
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CLADDING OR PLATING BY SOLDERING OR WELDING COMPUTING COUNTING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC DIGITAL DATA PROCESSING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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