Double far-side laser ablation
The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14′) deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising: directing a first laser beam (21) through on...
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| creator | David Charles Milne |
| description | The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14′) deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising: directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14′) and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21′) through one or more lenses (22′) to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21′) passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21′) and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21′) to scribe a second pattern in the second electrically conductive layer (14′). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_GB2529156B</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>GB2529156B</sourcerecordid><originalsourceid>FETCH-epo_espacenet_GB2529156B3</originalsourceid><addsrcrecordid>eNrjZJBzyS9NyklVSEss0i3OTElVyEksTi1SSEzKSSzJzM_jYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXx7k5GpkaWhqZmTsaEVQAASisjVg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Double far-side laser ablation</title><source>esp@cenet</source><creator>David Charles Milne</creator><creatorcontrib>David Charles Milne</creatorcontrib><description>The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14′) deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising: directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14′) and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21′) through one or more lenses (22′) to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21′) passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21′) and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21′) to scribe a second pattern in the second electrically conductive layer (14′).</description><language>eng</language><subject>CALCULATING ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COMPUTING ; COUNTING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC DIGITAL DATA PROCESSING ; 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initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21′) through one or more lenses (22′) to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21′) passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21′) and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21′) to scribe a second pattern in the second electrically conductive layer (14′).</description><subject>CALCULATING</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBzyS9NyklVSEss0i3OTElVyEksTi1SSEzKSSzJzM_jYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXx7k5GpkaWhqZmTsaEVQAASisjVg</recordid><startdate>20180207</startdate><enddate>20180207</enddate><creator>David Charles Milne</creator><scope>EVB</scope></search><sort><creationdate>20180207</creationdate><title>Double far-side laser ablation</title><author>David Charles Milne</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_GB2529156B3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>CALCULATING</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>David Charles Milne</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>David Charles Milne</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Double far-side laser ablation</title><date>2018-02-07</date><risdate>2018</risdate><abstract>The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14′) deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising: directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14′) and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21′) through one or more lenses (22′) to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21′) passes through the first electrically conductive layer (14) and the first surface (12) of the substrate (11), initiating relative movement between the second laser beam (21′) and the substrate (11) in two axes in a plane orthogonal to the axis of the second laser beam (21′) to scribe a second pattern in the second electrically conductive layer (14′).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CALCULATING CLADDING OR PLATING BY SOLDERING OR WELDING COMPUTING COUNTING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC DIGITAL DATA PROCESSING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Double far-side laser ablation |
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