Multi-step atomic layer deposition

A method of depositing a material on a substrate using an atomic layer deposition (ALD) process, preferably a plasma enhanced atomic layer deposition (PEALD) or thermal ALD process, wherein the deposition process comprises a first deposition step, a second deposition step subsequent to the first dep...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOUNGJIN CHOI, NATHAN CHARLES BROWN, CHARLES ANTHONY NIELD COLLIS, SAI GIRIDHAR SHIVAREDDY, GEHAN ANJIL JOSEPH AMARATUNGA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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