Cooling system

A cooling system for memory modules for example dual in-line memory modules (DIMMs) supporting dual random access memory (DRAM) chips (Fig. 2; 24) on either side of a circuit board (Fig. 2; 22) comprises a heat conduction assembly 10 for each memory module 20 which allows conduction of heat in a dir...

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Hauptverfasser: CHUNJIAN NI, VINOD KAMATH, MARK EDWARD STEINKE, DEREK IAN SCHMIDT, JAMES SCOTT WOMBLE, RICHARD BARINA
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creator CHUNJIAN NI
VINOD KAMATH
MARK EDWARD STEINKE
DEREK IAN SCHMIDT
JAMES SCOTT WOMBLE
RICHARD BARINA
description A cooling system for memory modules for example dual in-line memory modules (DIMMs) supporting dual random access memory (DRAM) chips (Fig. 2; 24) on either side of a circuit board (Fig. 2; 22) comprises a heat conduction assembly 10 for each memory module 20 which allows conduction of heat in a direction parallel to a system board 12, from the memory modules to a pair of liquid-cooled mounting blocks 40, 140 located at opposing ends of parallel slot shaped sockets 30 for receiving the modules. Each heat conduction assembly includes a frame having opposing first and second supports 61, 62, first and second heat spreader plates 64, 65 each extending from the first support 61 to the second support 62, and a pair of fluid-filled flattened heat pipes 66 each extending along a respective one of the heat spreader plates. The liquid-cooled mounting blocks 40, 140 releasably support the heat conduction assemblies over the memory module sockets 30 with the memory module between the heat spreader plates so that the memory chips are in thermal engagement with the heat spreader plates 64, 65.
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subjects BASIC ELECTRIC ELEMENTS
BLASTING
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
WEAPONS
title Cooling system
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