Semiconductor structure to reduce electromigration

A semiconductor structure which includes a plurality of stacked semiconductor chips in a three dimensional configuration. There is a first semiconductor chip in contact with a second semiconductor chip. The first semiconductor chip includes a through silicon via (TSV) extending through the first sem...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GARY LAFONTANT, THOMAS ANTHONY WASSICK, MARIO INTERRANTE, BUCKNELL WEBB, MICHAEL JAY SHAPIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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