Improved coreless package connections and associated methods

Improved coreless package connections and associated methods

A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent...

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Hauptverfasser: YAPING ZHOU, PAUL MARLAN HARVEY, COLM BRIAN O'REILLY, SAMUEL WYNNE YANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator YAPING ZHOU
PAUL MARLAN HARVEY
COLM BRIAN O'REILLY
SAMUEL WYNNE YANG
description A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Improved coreless package connections and associated methods
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