Optoelectronic module and method for removal
An optoelectronic module 100 comprising: an optoelectronic module housing 100a provided with upper and lower surfaces, the lower surface comprising a latch 125 which extends from the lower surface, the housing 100a is configured to mate with a cage 112, where the cage 112 has a tongue 122 with an op...
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| creator | ROBERT H YI |
| description | An optoelectronic module 100 comprising: an optoelectronic module housing 100a provided with upper and lower surfaces, the lower surface comprising a latch 125 which extends from the lower surface, the housing 100a is configured to mate with a cage 112, where the cage 112 has a tongue 122 with an opening 122a formed therein, the opening 122a being configured to mate with the latch 125 when the housing 100a is inserted into the cage 112; and an adapter 110 mechanically coupled to the housing 100a, the adapter 110 being configured to transfer an actuator force exerted on the adapter 110 from a removal tool 11 to the tongue 122a such that the tongue 122a is deflected a sufficient extent to disengage the latch 125. Also disclosed is a communications device comprising a cage 112, as above, mounted with a module housing 100a, also as above. Further disclosed is a method of removing a module housing 100a from a cage 112 comprising the use of a removal tool 11. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_GB2481703A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>GB2481703A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_GB2481703A3</originalsourceid><addsrcrecordid>eNrjZNDxLyjJT81JTS4pys_LTFbIzU8pzUlVSMxLUchNLcnIT1FIyy9SKErNzS9LzOFhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfHuTkYmFobmBsaOxoRVAAAKPSkS</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Optoelectronic module and method for removal</title><source>esp@cenet</source><creator>ROBERT H YI</creator><creatorcontrib>ROBERT H YI</creatorcontrib><description>An optoelectronic module 100 comprising: an optoelectronic module housing 100a provided with upper and lower surfaces, the lower surface comprising a latch 125 which extends from the lower surface, the housing 100a is configured to mate with a cage 112, where the cage 112 has a tongue 122 with an opening 122a formed therein, the opening 122a being configured to mate with the latch 125 when the housing 100a is inserted into the cage 112; and an adapter 110 mechanically coupled to the housing 100a, the adapter 110 being configured to transfer an actuator force exerted on the adapter 110 from a removal tool 11 to the tongue 122a such that the tongue 122a is deflected a sufficient extent to disengage the latch 125. Also disclosed is a communications device comprising a cage 112, as above, mounted with a module housing 100a, also as above. Further disclosed is a method of removing a module housing 100a from a cage 112 comprising the use of a removal tool 11.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120104&DB=EPODOC&CC=GB&NR=2481703A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120104&DB=EPODOC&CC=GB&NR=2481703A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROBERT H YI</creatorcontrib><title>Optoelectronic module and method for removal</title><description>An optoelectronic module 100 comprising: an optoelectronic module housing 100a provided with upper and lower surfaces, the lower surface comprising a latch 125 which extends from the lower surface, the housing 100a is configured to mate with a cage 112, where the cage 112 has a tongue 122 with an opening 122a formed therein, the opening 122a being configured to mate with the latch 125 when the housing 100a is inserted into the cage 112; and an adapter 110 mechanically coupled to the housing 100a, the adapter 110 being configured to transfer an actuator force exerted on the adapter 110 from a removal tool 11 to the tongue 122a such that the tongue 122a is deflected a sufficient extent to disengage the latch 125. Also disclosed is a communications device comprising a cage 112, as above, mounted with a module housing 100a, also as above. Further disclosed is a method of removing a module housing 100a from a cage 112 comprising the use of a removal tool 11.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDxLyjJT81JTS4pys_LTFbIzU8pzUlVSMxLUchNLcnIT1FIyy9SKErNzS9LzOFhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfHuTkYmFobmBsaOxoRVAAAKPSkS</recordid><startdate>20120104</startdate><enddate>20120104</enddate><creator>ROBERT H YI</creator><scope>EVB</scope></search><sort><creationdate>20120104</creationdate><title>Optoelectronic module and method for removal</title><author>ROBERT H YI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_GB2481703A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ROBERT H YI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ROBERT H YI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Optoelectronic module and method for removal</title><date>2012-01-04</date><risdate>2012</risdate><abstract>An optoelectronic module 100 comprising: an optoelectronic module housing 100a provided with upper and lower surfaces, the lower surface comprising a latch 125 which extends from the lower surface, the housing 100a is configured to mate with a cage 112, where the cage 112 has a tongue 122 with an opening 122a formed therein, the opening 122a being configured to mate with the latch 125 when the housing 100a is inserted into the cage 112; and an adapter 110 mechanically coupled to the housing 100a, the adapter 110 being configured to transfer an actuator force exerted on the adapter 110 from a removal tool 11 to the tongue 122a such that the tongue 122a is deflected a sufficient extent to disengage the latch 125. Also disclosed is a communications device comprising a cage 112, as above, mounted with a module housing 100a, also as above. Further disclosed is a method of removing a module housing 100a from a cage 112 comprising the use of a removal tool 11.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS |
| title | Optoelectronic module and method for removal |
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