Package Structure Of A Microphone

Package Structure Of A Microphone

A kind of microphone package structure includes at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bonding pad of the substrate is maintained. After connective past...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HSIN YANG, JIUNG-YUE TIEN, CHINING HUANG
Format: Patent
Sprache:eng
Schlagworte:
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:A kind of microphone package structure includes at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bonding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.