Package structure of a microphone

The microphone package 200 comprises a substrate 210, a sound processing unit 220, bonding pads 230, bonding wires 240 and an upper cap 260. There is at least one trench or connective area 211 on the substrate. The bonding pads and the trench or connective area lie in different planes on the substra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HSIN YANG, JIUNG-YUE TIEN, CHINING HUANG
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!