Creating layers in thin-film structures

A layer of a material is created in a thin-film structure by coating a substrate ( 14 ) in one pass with an ink having a major, fugitive component ( 13 ) and at least one minor, non-fugitive component ( 12 ) and treating the ink to expel the major component ( 13 ) to leave the layer ( 15 ) of materi...

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Hauptverfasser: WARREN LEE, MICHAEL STUART WAITE, RICHARD ALLAN TUCK, ADRIAN PAUL BURDEN
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creator WARREN LEE
MICHAEL STUART WAITE
RICHARD ALLAN TUCK
ADRIAN PAUL BURDEN
description A layer of a material is created in a thin-film structure by coating a substrate ( 14 ) in one pass with an ink having a major, fugitive component ( 13 ) and at least one minor, non-fugitive component ( 12 ) and treating the ink to expel the major component ( 13 ) to leave the layer ( 15 ) of material. The layer ( 15 ) may bean electrically insulating layer having a thickness in the range 0.5 to 10 micrometres, with the ink containing non-fugitive colloidal ceramic nanoparticles having a size in the range 10 to 100 nanometres. The layer ( 15 ) may be a process control. layer, such as an etch stop layer or barrier layer. The layer ( 15 ) may be an optically emissive layer or a layer of predetermined electrical conductivity.
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The layer ( 15 ) may bean electrically insulating layer having a thickness in the range 0.5 to 10 micrometres, with the ink containing non-fugitive colloidal ceramic nanoparticles having a size in the range 10 to 100 nanometres. The layer ( 15 ) may be a process control. layer, such as an etch stop layer or barrier layer. 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subjects ADHESIVES
ARTIFICIAL STONE
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CEMENTS
CERAMICS
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMICAL PAINT OR INK REMOVERS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
COLOUR PRINTING
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
CORRECTING FLUIDS
DIFFUSION TREATMENT OF METALLIC MATERIAL
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILLING PASTES
GLASS
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
INKS
JOINING GLASS TO GLASS OR OTHER MATERIALS
LIME, MAGNESIA
LINING MACHINES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MINERAL OR SLAG WOOL
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
POLISHES
PRINTED CIRCUITS
PRINTING
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES
REFRACTORIES
SEMICONDUCTOR DEVICES
SLAG
STAMPS
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TRANSPORTING
TREATMENT OF NATURAL STONE
TYPEWRITERS
USE OF MATERIALS THEREFOR
WOODSTAINS
title Creating layers in thin-film structures
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