Heat sinks

A heat sink 10 is held against a component to be cooled on a substrate by means such as springs 42, suitably acting through a second heat sink 12 with a heat pipe 16 interposed between the two sinks. In a second embodiment a frame (22, Fig 4) engages a shoulder on the heat sink 10 and is pressed tow...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KLAUS HEESEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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