Heat sinks

A heat sink 10 is held against a component to be cooled on a substrate by means such as springs 42, suitably acting through a second heat sink 12 with a heat pipe 16 interposed between the two sinks. In a second embodiment a frame (22, Fig 4) engages a shoulder on the heat sink 10 and is pressed tow...

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1. Verfasser:	KLAUS HEESEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	KLAUS HEESEN
description	A heat sink 10 is held against a component to be cooled on a substrate by means such as springs 42, suitably acting through a second heat sink 12 with a heat pipe 16 interposed between the two sinks. In a second embodiment a frame (22, Fig 4) engages a shoulder on the heat sink 10 and is pressed towards the substrate by springs (54) or screws (Fig 5) and the upper surface of the heat sink has alternative apertures in which a heat pipe (16) may selectively be inserted. A third embodiment combines the features of a frame (22, Fig 7) attached to the substrate by screws and a second heat sink (12) sandwiching a heat pipe (16).
format	Patent
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In a second embodiment a frame (22, Fig 4) engages a shoulder on the heat sink 10 and is pressed towards the substrate by springs (54) or screws (Fig 5) and the upper surface of the heat sink has alternative apertures in which a heat pipe (16) may selectively be inserted. 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title	Heat sinks
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