System and method for enhanced led thermal conductivity

System and method for enhanced led thermal conductivity

A light emitting device 10, 50 assembly comprises a light emitting diode (LED) chip 100, 500-1, 500-N, a substrate with two terminals,, at least one encapsulation layer 108, 508, and a thermally conductive adhesive 102, 502-1, 502-N to connect the LED chip and the substrate. The first terminal 101 o...

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Hauptverfasser: KEE YEAN NG, SUNDAR A L N YOGANANDAN
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KEE YEAN NG
SUNDAR A L N YOGANANDAN
description A light emitting device 10, 50 assembly comprises a light emitting diode (LED) chip 100, 500-1, 500-N, a substrate with two terminals,, at least one encapsulation layer 108, 508, and a thermally conductive adhesive 102, 502-1, 502-N to connect the LED chip and the substrate. The first terminal 101 of the substrate is comprised of a portion 103 with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. The enlarged first terminal portion provides more area for heat dissipation and conduction, and along with the thermally conductive adhesive and the encapsulation package, provide enhanced thermal conductivity.
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The first terminal 101 of the substrate is comprised of a portion 103 with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title System and method for enhanced led thermal conductivity
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