Vector transient reflow of solder for controlling substrate warpage

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Hauptverfasser: LARRY N SCHMIDT, LAKHI N GOENKA, SHERWIN T MOSS, PETER JOSEPH SINKUNAS
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creator LARRY N SCHMIDT
LAKHI N GOENKA
SHERWIN T MOSS
PETER JOSEPH SINKUNAS
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Vector transient reflow of solder for controlling substrate warpage
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