Vector transient reflow of solder for controlling substrate warpage
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creator | LARRY N SCHMIDT LAKHI N GOENKA SHERWIN T MOSS PETER JOSEPH SINKUNAS |
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CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050720&DB=EPODOC&CC=GB&NR=2401338B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050720&DB=EPODOC&CC=GB&NR=2401338B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LARRY N SCHMIDT</creatorcontrib><creatorcontrib>LAKHI N GOENKA</creatorcontrib><creatorcontrib>SHERWIN T MOSS</creatorcontrib><creatorcontrib>PETER JOSEPH SINKUNAS</creatorcontrib><title>Vector transient reflow of solder for controlling substrate warpage</title><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAOS00uyS9SKClKzCvOTM0rUShKTcvJL1fIT1Mozs9JSS1SSANKJ-fnlRTl5-Rk5qUrFJcmFQOVl6QqlCcWFSSmp_IwsKYl5hSn8kJpbgZ5N9cQZw_d1IL8-NTigsTk1LzUknh3JyMTA0NjYwsnY8IqAAC6MjA</recordid><startdate>20050720</startdate><enddate>20050720</enddate><creator>LARRY N SCHMIDT</creator><creator>LAKHI N GOENKA</creator><creator>SHERWIN T MOSS</creator><creator>PETER JOSEPH SINKUNAS</creator><scope>EVB</scope></search><sort><creationdate>20050720</creationdate><title>Vector transient reflow of solder for controlling substrate warpage</title><author>LARRY N SCHMIDT ; 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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
title | Vector transient reflow of solder for controlling substrate warpage |
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