Substrate with conducting vias

A component for electrical or electronic use comprises a laminar substrate 1 having first and second opposed major surfaces with at least one electrically conductive path or via 9 extending therebetween, said path being provided by a through substrate hole 7 extending between the first and second su...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MELODY ANN BRANFIELD, ALAN GERALD BROWN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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