Environmentally-sealed electronic assembly and method of making same
An electronic assembly includes a flexible substrate (14) having integral conductive traces (24) an electronic component (26), a filler material (30), and a barrier member (34).
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | CHARLES FREDERICK SCHWEITZER BRENDA JOYCE NATION DANIEL PHILLIP DAILEY LELIN LI ANDREW ZACHARY GLOVATSKY |
| description | An electronic assembly includes a flexible substrate (14) having integral conductive traces (24) an electronic component (26), a filler material (30), and a barrier member (34). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_GB2369932A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>GB2369932A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_GB2369932A3</originalsourceid><addsrcrecordid>eNrjZHBxzSvLLMrPy03NK0nMyanULU5NzElNUUjNSU0uAYpnJiskFhen5iblVCok5qUo5KaWZOSnKOSnKeQmZmfmpSsUJ-am8jCwpiXmFKfyQmluBnk31xBnD93Ugvz41OKCxOTUvNSSeHcnI2MzS0tjI0djwioAKuAySw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Environmentally-sealed electronic assembly and method of making same</title><source>esp@cenet</source><creator>CHARLES FREDERICK SCHWEITZER ; BRENDA JOYCE NATION ; DANIEL PHILLIP DAILEY ; LELIN LI ; ANDREW ZACHARY GLOVATSKY</creator><creatorcontrib>CHARLES FREDERICK SCHWEITZER ; BRENDA JOYCE NATION ; DANIEL PHILLIP DAILEY ; LELIN LI ; ANDREW ZACHARY GLOVATSKY</creatorcontrib><description>An electronic assembly includes a flexible substrate (14) having integral conductive traces (24) an electronic component (26), a filler material (30), and a barrier member (34).</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020612&DB=EPODOC&CC=GB&NR=2369932A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020612&DB=EPODOC&CC=GB&NR=2369932A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHARLES FREDERICK SCHWEITZER</creatorcontrib><creatorcontrib>BRENDA JOYCE NATION</creatorcontrib><creatorcontrib>DANIEL PHILLIP DAILEY</creatorcontrib><creatorcontrib>LELIN LI</creatorcontrib><creatorcontrib>ANDREW ZACHARY GLOVATSKY</creatorcontrib><title>Environmentally-sealed electronic assembly and method of making same</title><description>An electronic assembly includes a flexible substrate (14) having integral conductive traces (24) an electronic component (26), a filler material (30), and a barrier member (34).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBxzSvLLMrPy03NK0nMyanULU5NzElNUUjNSU0uAYpnJiskFhen5iblVCok5qUo5KaWZOSnKOSnKeQmZmfmpSsUJ-am8jCwpiXmFKfyQmluBnk31xBnD93Ugvz41OKCxOTUvNSSeHcnI2MzS0tjI0djwioAKuAySw</recordid><startdate>20020612</startdate><enddate>20020612</enddate><creator>CHARLES FREDERICK SCHWEITZER</creator><creator>BRENDA JOYCE NATION</creator><creator>DANIEL PHILLIP DAILEY</creator><creator>LELIN LI</creator><creator>ANDREW ZACHARY GLOVATSKY</creator><scope>EVB</scope></search><sort><creationdate>20020612</creationdate><title>Environmentally-sealed electronic assembly and method of making same</title><author>CHARLES FREDERICK SCHWEITZER ; BRENDA JOYCE NATION ; DANIEL PHILLIP DAILEY ; LELIN LI ; ANDREW ZACHARY GLOVATSKY</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_GB2369932A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHARLES FREDERICK SCHWEITZER</creatorcontrib><creatorcontrib>BRENDA JOYCE NATION</creatorcontrib><creatorcontrib>DANIEL PHILLIP DAILEY</creatorcontrib><creatorcontrib>LELIN LI</creatorcontrib><creatorcontrib>ANDREW ZACHARY GLOVATSKY</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHARLES FREDERICK SCHWEITZER</au><au>BRENDA JOYCE NATION</au><au>DANIEL PHILLIP DAILEY</au><au>LELIN LI</au><au>ANDREW ZACHARY GLOVATSKY</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Environmentally-sealed electronic assembly and method of making same</title><date>2002-06-12</date><risdate>2002</risdate><abstract>An electronic assembly includes a flexible substrate (14) having integral conductive traces (24) an electronic component (26), a filler material (30), and a barrier member (34).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_GB2369932A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Environmentally-sealed electronic assembly and method of making same |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-02T21%3A49%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHARLES%20FREDERICK%20SCHWEITZER&rft.date=2002-06-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EGB2369932A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |