Semiconductor device

Semiconductor device

A semiconductor device is formed of a casing, a substrate situated in the casing, at least one semiconductor chip fixed on the substrate, and at least one lead-out terminal for connecting the semiconductor chip to outside. The lead-out terminal includes a soldered portion soldered to the substrate,...

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Hauptverfasser: SOUICHI OKITA, TAKATOSHI KOBAYASHI, RIKIHIRO MARUYAMA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SOUICHI OKITA
TAKATOSHI KOBAYASHI
RIKIHIRO MARUYAMA
description A semiconductor device is formed of a casing, a substrate situated in the casing, at least one semiconductor chip fixed on the substrate, and at least one lead-out terminal for connecting the semiconductor chip to outside. The lead-out terminal includes a soldered portion soldered to the substrate, and a fixed portion fixed to the casing. A stress relaxing device or cutout is formed between the soldered portion and the fixed portion of the lead-out terminal to relieve stress along three axial directions orthogonal to each other. Thus, the crack formation is prevented in the soldered portion of the lead-out terminal while the resistance and impedance of the lead-out terminal are maintained at low values.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device
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