Redundancy in integrated circuits
A substrate 1 has several conductive tracks 21 and a switching matrix 30 within the thickness of the substrate. Several groups 5 to 12 of identical integrated circuits are mounted on the substrate, one circuit from each group being operatively connected into the assembly by the switching matrix. A p...
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| creator | EDWARD STUART ECCLES |
| description | A substrate 1 has several conductive tracks 21 and a switching matrix 30 within the thickness of the substrate. Several groups 5 to 12 of identical integrated circuits are mounted on the substrate, one circuit from each group being operatively connected into the assembly by the switching matrix. A processor 4 detects malfunction of a circuit and controls the switching matrix 30 to disconnect that circuit and operatively connect into the assembly an alternative circuit from the same group. |
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Several groups 5 to 12 of identical integrated circuits are mounted on the substrate, one circuit from each group being operatively connected into the assembly by the switching matrix. A processor 4 detects malfunction of a circuit and controls the switching matrix 30 to disconnect that circuit and operatively connect into the assembly an alternative circuit from the same group.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS PULSE TECHNIQUE SEMICONDUCTOR DEVICES |
| title | Redundancy in integrated circuits |
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