Printed wiring board

Printed wiring board

A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive...

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Hauptverfasser: HIROTAKA OKONOGI, JUNICHI ICHIKAWA, SHIN KAWAKAMI, KATSUTOMO NIKAIDO, YOSHIO NISHIYAMA
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator HIROTAKA OKONOGI
JUNICHI ICHIKAWA
SHIN KAWAKAMI
KATSUTOMO NIKAIDO
YOSHIO NISHIYAMA
description A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_GB2248972B</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>GB2248972B</sourcerecordid><originalsourceid>FETCH-epo_espacenet_GB2248972B3</originalsourceid><addsrcrecordid>eNrjZBAJKMrMK0lNUSjPBDLSFZLyE4tSeBhY0xJzilN5oTQ3g7yba4izh25qQX58anFBYnJqXmpJvLuTkZGJhaW5kZMxYRUAyRkf2w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed wiring board</title><source>esp@cenet</source><creator>HIROTAKA OKONOGI ; JUNICHI ICHIKAWA ; SHIN KAWAKAMI ; KATSUTOMO NIKAIDO ; YOSHIO NISHIYAMA</creator><creatorcontrib>HIROTAKA OKONOGI ; JUNICHI ICHIKAWA ; SHIN KAWAKAMI ; KATSUTOMO NIKAIDO ; YOSHIO NISHIYAMA</creatorcontrib><description>A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.</description><edition>5</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19940615&amp;DB=EPODOC&amp;CC=GB&amp;NR=2248972B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19940615&amp;DB=EPODOC&amp;CC=GB&amp;NR=2248972B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIROTAKA OKONOGI</creatorcontrib><creatorcontrib>JUNICHI ICHIKAWA</creatorcontrib><creatorcontrib>SHIN KAWAKAMI</creatorcontrib><creatorcontrib>KATSUTOMO NIKAIDO</creatorcontrib><creatorcontrib>YOSHIO NISHIYAMA</creatorcontrib><title>Printed wiring board</title><description>A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJKMrMK0lNUSjPBDLSFZLyE4tSeBhY0xJzilN5oTQ3g7yba4izh25qQX58anFBYnJqXmpJvLuTkZGJhaW5kZMxYRUAyRkf2w</recordid><startdate>19940615</startdate><enddate>19940615</enddate><creator>HIROTAKA OKONOGI</creator><creator>JUNICHI ICHIKAWA</creator><creator>SHIN KAWAKAMI</creator><creator>KATSUTOMO NIKAIDO</creator><creator>YOSHIO NISHIYAMA</creator><scope>EVB</scope></search><sort><creationdate>19940615</creationdate><title>Printed wiring board</title><author>HIROTAKA OKONOGI ; JUNICHI ICHIKAWA ; SHIN KAWAKAMI ; KATSUTOMO NIKAIDO ; YOSHIO NISHIYAMA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_GB2248972B3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1994</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HIROTAKA OKONOGI</creatorcontrib><creatorcontrib>JUNICHI ICHIKAWA</creatorcontrib><creatorcontrib>SHIN KAWAKAMI</creatorcontrib><creatorcontrib>KATSUTOMO NIKAIDO</creatorcontrib><creatorcontrib>YOSHIO NISHIYAMA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIROTAKA OKONOGI</au><au>JUNICHI ICHIKAWA</au><au>SHIN KAWAKAMI</au><au>KATSUTOMO NIKAIDO</au><au>YOSHIO NISHIYAMA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed wiring board</title><date>1994-06-15</date><risdate>1994</risdate><abstract>A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Printed wiring board
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-21T13%3A44%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HIROTAKA%20OKONOGI&rft.date=1994-06-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EGB2248972B%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true