Electrical circuit assemblies

An electrical circuit assembly comprising a plurality of stacks 10 on a common, at least generally planar, support 10A, each stack having a plurality of substantially identically constructed modules 11, each module including a planar substrate 12, with constituent elements of a circuit thereon, has...

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creator HUGH MCPHERSON
description An electrical circuit assembly comprising a plurality of stacks 10 on a common, at least generally planar, support 10A, each stack having a plurality of substantially identically constructed modules 11, each module including a planar substrate 12, with constituent elements of a circuit thereon, has adjacent pairs of substrates spaced apart, so that a cooling fluid, such as air, can flow therebetween, through each stack, and sequentially through at least two stacks. Members 17 are provided, each, at least partially, holding the modules in their required locations in each stack, and such members may comprise, or include, electrical interconnections between the modules. Heat conducting members, possibly formed with fins, may also be mounted on the substrates, in the path of the cooling fluid, and opposing such heat conducting members within a stack may define passages for the cooling fluid. A plurality of such electrical circuit assemblies may be mounted upon a common, at least generally, planar mother support.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_GB2122032A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>GB2122032A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_GB2122032A3</originalsourceid><addsrcrecordid>eNrjZJB1zUlNLinKTE7MUUjOLEouzSxRSCwuTs1NyslMLeZhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfHuTkaGRkYGxkaOxoRVAABSuyNb</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electrical circuit assemblies</title><source>esp@cenet</source><creator>HUGH MCPHERSON</creator><creatorcontrib>HUGH MCPHERSON</creatorcontrib><description>An electrical circuit assembly comprising a plurality of stacks 10 on a common, at least generally planar, support 10A, each stack having a plurality of substantially identically constructed modules 11, each module including a planar substrate 12, with constituent elements of a circuit thereon, has adjacent pairs of substrates spaced apart, so that a cooling fluid, such as air, can flow therebetween, through each stack, and sequentially through at least two stacks. Members 17 are provided, each, at least partially, holding the modules in their required locations in each stack, and such members may comprise, or include, electrical interconnections between the modules. Heat conducting members, possibly formed with fins, may also be mounted on the substrates, in the path of the cooling fluid, and opposing such heat conducting members within a stack may define passages for the cooling fluid. A plurality of such electrical circuit assemblies may be mounted upon a common, at least generally, planar mother support.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1984</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19840104&amp;DB=EPODOC&amp;CC=GB&amp;NR=2122032A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19840104&amp;DB=EPODOC&amp;CC=GB&amp;NR=2122032A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUGH MCPHERSON</creatorcontrib><title>Electrical circuit assemblies</title><description>An electrical circuit assembly comprising a plurality of stacks 10 on a common, at least generally planar, support 10A, each stack having a plurality of substantially identically constructed modules 11, each module including a planar substrate 12, with constituent elements of a circuit thereon, has adjacent pairs of substrates spaced apart, so that a cooling fluid, such as air, can flow therebetween, through each stack, and sequentially through at least two stacks. Members 17 are provided, each, at least partially, holding the modules in their required locations in each stack, and such members may comprise, or include, electrical interconnections between the modules. Heat conducting members, possibly formed with fins, may also be mounted on the substrates, in the path of the cooling fluid, and opposing such heat conducting members within a stack may define passages for the cooling fluid. A plurality of such electrical circuit assemblies may be mounted upon a common, at least generally, planar mother support.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1984</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB1zUlNLinKTE7MUUjOLEouzSxRSCwuTs1NyslMLeZhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfHuTkaGRkYGxkaOxoRVAABSuyNb</recordid><startdate>19840104</startdate><enddate>19840104</enddate><creator>HUGH MCPHERSON</creator><scope>EVB</scope></search><sort><creationdate>19840104</creationdate><title>Electrical circuit assemblies</title><author>HUGH MCPHERSON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_GB2122032A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1984</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUGH MCPHERSON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUGH MCPHERSON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electrical circuit assemblies</title><date>1984-01-04</date><risdate>1984</risdate><abstract>An electrical circuit assembly comprising a plurality of stacks 10 on a common, at least generally planar, support 10A, each stack having a plurality of substantially identically constructed modules 11, each module including a planar substrate 12, with constituent elements of a circuit thereon, has adjacent pairs of substrates spaced apart, so that a cooling fluid, such as air, can flow therebetween, through each stack, and sequentially through at least two stacks. Members 17 are provided, each, at least partially, holding the modules in their required locations in each stack, and such members may comprise, or include, electrical interconnections between the modules. Heat conducting members, possibly formed with fins, may also be mounted on the substrates, in the path of the cooling fluid, and opposing such heat conducting members within a stack may define passages for the cooling fluid. A plurality of such electrical circuit assemblies may be mounted upon a common, at least generally, planar mother support.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Electrical circuit assemblies
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T08%3A35%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUGH%20MCPHERSON&rft.date=1984-01-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EGB2122032A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true