Semiconductor Structure
L'invention concerne une structure semi-conductrice comprend : une plaquette ; un chiplet fixé à ladite plaquette, et comprenant un dispositif semi-conducteur et une ou plusieurs couches métalliques connectées audit dispositif semi-conducteur ; une structure d'interface pour connecter un b...
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| creator | DRILLET, Frédéric U'REN, Gregory LAHBIB, Imène |
| description | L'invention concerne une structure semi-conductrice comprend : une plaquette ; un chiplet fixé à ladite plaquette, et comprenant un dispositif semi-conducteur et une ou plusieurs couches métalliques connectées audit dispositif semi-conducteur ; une structure d'interface pour connecter un boîtier électronique à la plaquette ; et une structure de dissipation de chaleur pour transférer la chaleur du chiplet à la structure d'interface. Figure pour l'abrégé : Fig. 8
A semiconductor structure comprises: a wafer 20; a chiplet 2 attached to said wafer wherein the chiplet has a metal contact on its upper surface; an interface structure for connecting an electronic package to the wafer; and a heat dissipation structure for transferring heat from the chiplet to the interface 10 structure. The heat dissipation structure may include several dissipation means such as thermal pins 36 in the chiplet; a redistribution layer, RDL, 12 that has contacts that do not provide electrical device signals; and a plurality of metal layers 52 within the wafer. The chiplet and wafer may also have a passivation layer 34. This structure can be used for heat management after micro transfer print process. |
| format | Patent |
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A semiconductor structure comprises: a wafer 20; a chiplet 2 attached to said wafer wherein the chiplet has a metal contact on its upper surface; an interface structure for connecting an electronic package to the wafer; and a heat dissipation structure for transferring heat from the chiplet to the interface 10 structure. The heat dissipation structure may include several dissipation means such as thermal pins 36 in the chiplet; a redistribution layer, RDL, 12 that has contacts that do not provide electrical device signals; and a plurality of metal layers 52 within the wafer. The chiplet and wafer may also have a passivation layer 34. This structure can be used for heat management after micro transfer print process.</description><language>fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240823&DB=EPODOC&CC=FR&NR=3146021A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240823&DB=EPODOC&CC=FR&NR=3146021A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DRILLET, Frédéric</creatorcontrib><creatorcontrib>U'REN, Gregory</creatorcontrib><creatorcontrib>LAHBIB, Imène</creatorcontrib><title>Semiconductor Structure</title><description>L'invention concerne une structure semi-conductrice comprend : une plaquette ; un chiplet fixé à ladite plaquette, et comprenant un dispositif semi-conducteur et une ou plusieurs couches métalliques connectées audit dispositif semi-conducteur ; une structure d'interface pour connecter un boîtier électronique à la plaquette ; et une structure de dissipation de chaleur pour transférer la chaleur du chiplet à la structure d'interface. Figure pour l'abrégé : Fig. 8
A semiconductor structure comprises: a wafer 20; a chiplet 2 attached to said wafer wherein the chiplet has a metal contact on its upper surface; an interface structure for connecting an electronic package to the wafer; and a heat dissipation structure for transferring heat from the chiplet to the interface 10 structure. The heat dissipation structure may include several dissipation means such as thermal pins 36 in the chiplet; a redistribution layer, RDL, 12 that has contacts that do not provide electrical device signals; and a plurality of metal layers 52 within the wafer. The chiplet and wafer may also have a passivation layer 34. This structure can be used for heat management after micro transfer print process.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAPTs3NTM7PSylNLskvUgguKQIySotSeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJvFuQsaGJmYGRoaOhMRFKALHpId4</recordid><startdate>20240823</startdate><enddate>20240823</enddate><creator>DRILLET, Frédéric</creator><creator>U'REN, Gregory</creator><creator>LAHBIB, Imène</creator><scope>EVB</scope></search><sort><creationdate>20240823</creationdate><title>Semiconductor Structure</title><author>DRILLET, Frédéric ; U'REN, Gregory ; LAHBIB, Imène</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FR3146021A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>fre</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>DRILLET, Frédéric</creatorcontrib><creatorcontrib>U'REN, Gregory</creatorcontrib><creatorcontrib>LAHBIB, Imène</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DRILLET, Frédéric</au><au>U'REN, Gregory</au><au>LAHBIB, Imène</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor Structure</title><date>2024-08-23</date><risdate>2024</risdate><abstract>L'invention concerne une structure semi-conductrice comprend : une plaquette ; un chiplet fixé à ladite plaquette, et comprenant un dispositif semi-conducteur et une ou plusieurs couches métalliques connectées audit dispositif semi-conducteur ; une structure d'interface pour connecter un boîtier électronique à la plaquette ; et une structure de dissipation de chaleur pour transférer la chaleur du chiplet à la structure d'interface. Figure pour l'abrégé : Fig. 8
A semiconductor structure comprises: a wafer 20; a chiplet 2 attached to said wafer wherein the chiplet has a metal contact on its upper surface; an interface structure for connecting an electronic package to the wafer; and a heat dissipation structure for transferring heat from the chiplet to the interface 10 structure. The heat dissipation structure may include several dissipation means such as thermal pins 36 in the chiplet; a redistribution layer, RDL, 12 that has contacts that do not provide electrical device signals; and a plurality of metal layers 52 within the wafer. The chiplet and wafer may also have a passivation layer 34. This structure can be used for heat management after micro transfer print process.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor Structure |
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