Dispositif électronique comprenant un substrat de support et un capot d'encapsulation monté sur le substrat de support, et procédé de montage correspondant
Le dispositif électronique (DIS) comprend un substrat de support (100) destiné à supporter au moins une puce électronique (50) et présentant une face avant de montage (101) et un capot d'encapsulation (200) monté sur ladite face avant (101) du substrat de support (100) par un montage comprenant...
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| creator | MASTROMAURO, Nicolas SAXOD, Karine |
| description | Le dispositif électronique (DIS) comprend un substrat de support (100) destiné à supporter au moins une puce électronique (50) et présentant une face avant de montage (101) et un capot d'encapsulation (200) monté sur ladite face avant (101) du substrat de support (100) par un montage comprenant au moins une surface d'appui (300) sur laquelle ledit capot (200) et ledit substrat (100) sont en contact. Au moins un cordon de colle (150) est localisé en dehors de la surface d'appui (300) pour solidariser ledit capot (200) et ledit substrat de support (100). Figure pour l'abrégé : Fig 1
A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_FR3103056B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>FR3103056B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_FR3103056B13</originalsourceid><addsrcrecordid>eNqNjjsOwkAMRNNQIOAO7mhAShTBAfhE1Ig-WjYOWimxl13veahzjlwMB1FSUHnkeaOZefY6ueg5OnEtjEOHVgKTeyYEy70PSIYEEkFM9yjBCDSo2nsOAvhxrPGs7zWSqpg6I44JeiYZB0UDdPgrvZniPrAdh0ZBNaaIeUzFIaCOoka7l9msNV3E1fcuMqjOt-Nli55rpYxFQqmra1nkZb7bH4ryD-QNjNdYGQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Dispositif électronique comprenant un substrat de support et un capot d'encapsulation monté sur le substrat de support, et procédé de montage correspondant</title><source>esp@cenet</source><creator>MASTROMAURO, Nicolas ; SAXOD, Karine</creator><creatorcontrib>MASTROMAURO, Nicolas ; SAXOD, Karine</creatorcontrib><description>Le dispositif électronique (DIS) comprend un substrat de support (100) destiné à supporter au moins une puce électronique (50) et présentant une face avant de montage (101) et un capot d'encapsulation (200) monté sur ladite face avant (101) du substrat de support (100) par un montage comprenant au moins une surface d'appui (300) sur laquelle ledit capot (200) et ledit substrat (100) sont en contact. Au moins un cordon de colle (150) est localisé en dehors de la surface d'appui (300) pour solidariser ledit capot (200) et ledit substrat de support (100). Figure pour l'abrégé : Fig 1
A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.</description><language>fre</language><subject>ANALOGOUS ARRANGEMENTS USING OTHER WAVES ; BASIC ELECTRIC ELEMENTS ; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES ; MEASURING ; PHYSICS ; RADIO DIRECTION-FINDING ; RADIO NAVIGATION ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220708&DB=EPODOC&CC=FR&NR=3103056B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220708&DB=EPODOC&CC=FR&NR=3103056B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MASTROMAURO, Nicolas</creatorcontrib><creatorcontrib>SAXOD, Karine</creatorcontrib><title>Dispositif électronique comprenant un substrat de support et un capot d'encapsulation monté sur le substrat de support, et procédé de montage correspondant</title><description>Le dispositif électronique (DIS) comprend un substrat de support (100) destiné à supporter au moins une puce électronique (50) et présentant une face avant de montage (101) et un capot d'encapsulation (200) monté sur ladite face avant (101) du substrat de support (100) par un montage comprenant au moins une surface d'appui (300) sur laquelle ledit capot (200) et ledit substrat (100) sont en contact. Au moins un cordon de colle (150) est localisé en dehors de la surface d'appui (300) pour solidariser ledit capot (200) et ledit substrat de support (100). Figure pour l'abrégé : Fig 1
A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.</description><subject>ANALOGOUS ARRANGEMENTS USING OTHER WAVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>RADIO DIRECTION-FINDING</subject><subject>RADIO NAVIGATION</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjjsOwkAMRNNQIOAO7mhAShTBAfhE1Ig-WjYOWimxl13veahzjlwMB1FSUHnkeaOZefY6ueg5OnEtjEOHVgKTeyYEy70PSIYEEkFM9yjBCDSo2nsOAvhxrPGs7zWSqpg6I44JeiYZB0UDdPgrvZniPrAdh0ZBNaaIeUzFIaCOoka7l9msNV3E1fcuMqjOt-Nli55rpYxFQqmra1nkZb7bH4ryD-QNjNdYGQ</recordid><startdate>20220708</startdate><enddate>20220708</enddate><creator>MASTROMAURO, Nicolas</creator><creator>SAXOD, Karine</creator><scope>EVB</scope></search><sort><creationdate>20220708</creationdate><title>Dispositif électronique comprenant un substrat de support et un capot d'encapsulation monté sur le substrat de support, et procédé de montage correspondant</title><author>MASTROMAURO, Nicolas ; SAXOD, Karine</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FR3103056B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>fre</language><creationdate>2022</creationdate><topic>ANALOGOUS ARRANGEMENTS USING OTHER WAVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>RADIO DIRECTION-FINDING</topic><topic>RADIO NAVIGATION</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MASTROMAURO, Nicolas</creatorcontrib><creatorcontrib>SAXOD, Karine</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MASTROMAURO, Nicolas</au><au>SAXOD, Karine</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Dispositif électronique comprenant un substrat de support et un capot d'encapsulation monté sur le substrat de support, et procédé de montage correspondant</title><date>2022-07-08</date><risdate>2022</risdate><abstract>Le dispositif électronique (DIS) comprend un substrat de support (100) destiné à supporter au moins une puce électronique (50) et présentant une face avant de montage (101) et un capot d'encapsulation (200) monté sur ladite face avant (101) du substrat de support (100) par un montage comprenant au moins une surface d'appui (300) sur laquelle ledit capot (200) et ledit substrat (100) sont en contact. Au moins un cordon de colle (150) est localisé en dehors de la surface d'appui (300) pour solidariser ledit capot (200) et ledit substrat de support (100). Figure pour l'abrégé : Fig 1
A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SEMICONDUCTOR DEVICES TESTING |
| title | Dispositif électronique comprenant un substrat de support et un capot d'encapsulation monté sur le substrat de support, et procédé de montage correspondant |
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