PROCEDE D'ENCAPSULATION D'UN DISPOSITIF MICROELECTRONIQUE AVEC UN TROU DE LIBERATION DE DIMENSION VARIABLE

A method of encapsulating a microelectronic device (100), comprising the following steps: making a sacrificial portion for covering the device; making a cover (106) for covering the sacrificial portion; the cover (106) comprises two superposed layers (108, 110) of discrete materials with different r...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BAILLIN XAVIER, PORNIN JEAN-LOUIS
Format:	Patent
Sprache:	fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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