FOUR CONTINU POUR SUBSTRATS QUI SONT EQUIPES DE COMPOSANTS ET DISPOSITIF D'ASSEMBLAGE DE DES

A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connec...

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Bibliographische Detailangaben
Hauptverfasser: SUTER GUIDO, DOMANCICH KEVIN, SCHERER DANIEL ANDREAS, WEIBEL RETO
Format: Patent
Sprache:fre
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Beschreibung
Zusammenfassung:A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.