DISPOSITIF MICROMECANIQUE A CHAUFFAGE INTEGRE
The device has a micromechanical sensor unit (120) and /or a passivation agent (160) e.g. gel, surrounding the sensor unit using heating units (200, 210, 220, 230). The heating units are controlled according to a temperature value representing the temperature of the passivation agent. The sensor uni...
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creator | MUEHLHEIM RICHARD LEPIDIS POLICHRONIS WEHRMANN FRANK |
description | The device has a micromechanical sensor unit (120) and /or a passivation agent (160) e.g. gel, surrounding the sensor unit using heating units (200, 210, 220, 230). The heating units are controlled according to a temperature value representing the temperature of the passivation agent. The sensor unit and/or the agent are heated above the temperature of a corrosive environment surrounding the device. An independent claim is also included for a method for controlling and/or adjusting the heating power of a heating unit in a micromechanical device. |
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The heating units are controlled according to a temperature value representing the temperature of the passivation agent. The sensor unit and/or the agent are heated above the temperature of a corrosive environment surrounding the device. An independent claim is also included for a method for controlling and/or adjusting the heating power of a heating unit in a micromechanical device.</description><language>fre</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; MEASURING MAGNETIC VARIABLES ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; TESTING ; TRANSPORTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130614&DB=EPODOC&CC=FR&NR=2873809B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130614&DB=EPODOC&CC=FR&NR=2873809B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MUEHLHEIM RICHARD</creatorcontrib><creatorcontrib>LEPIDIS POLICHRONIS</creatorcontrib><creatorcontrib>WEHRMANN FRANK</creatorcontrib><title>DISPOSITIF MICROMECANIQUE A CHAUFFAGE INTEGRE</title><description>The device has a micromechanical sensor unit (120) and /or a passivation agent (160) e.g. gel, surrounding the sensor unit using heating units (200, 210, 220, 230). 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subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING MAGNETIC VARIABLES MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TESTING TRANSPORTING |
title | DISPOSITIF MICROMECANIQUE A CHAUFFAGE INTEGRE |
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