PROCEDE DE RACCORDEMENT ELECTRIQUE DE PUCES DE TRANSISTOR IGBT MONTEES SUR UNE PLAQUETTE DE CIRCUITS INTEGRES

Electrical connection of an insulated-gate bipolar transistor (IGBT) chip mounted on an integrated circuit chip (10) comprises soldering electrodes (26,28), and forming control grid or gate (28) electrodes on a conducting plate (28) with projecting sections having connection plots which are joined b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANGEY NICOLAS, RANCHY ERIC, CROUZY SOPHIE, PETITBON ALAIN
Format:	Patent
Sprache:	fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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