Test socket and method of producing microchips identified as serviceable by using this socket
The invention relates to a test socket (20) comprising: a substrate (22) including conductors (24) having external contacts which come into contact with an external burn-in (debugging) test card at a first lateral end of the said test socket, a series of through openings (21) situated at a predeterm...
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| creator | HYUN IN HO KIM IL UNG LEE SANG HYEOG |
| description | The invention relates to a test socket (20) comprising: a substrate (22) including conductors (24) having external contacts which come into contact with an external burn-in (debugging) test card at a first lateral end of the said test socket, a series of through openings (21) situated at a predetermined distance from the said contact conductors (24), and at least one or more configurations of conducting depositions (27) formed around the said through openings (21) so as to be linked to the said contact conductors (24) by means of metal wires (30); a series of semiconducting microchips mounted using an adhesive means on an upper part of the said through openings formed in the central part of the said substrate and includng a series of solder beads (25); metal wires (28) electrically linking solder beads of the said microchips to the said configurations of conducting depositions; and a housing (29), forming a cover for the substrate (22), assembled with the aid of assembling means so as to expose the said external contact conductors (24) of the said substrate and to protect the said wires and the said semiconductor microchips by covering them.
L'invention concerne une douille d'essais (20) comprenant: un substrat (22) incluant des conducteurs (24) de contacts extérieurs qui viennent en contact avec une carte extérieure d'essais de déverminage à une première extrémité latérale de ladite douille d'essais, une série d'ouvertures traversantes (21) situées à une distance prédéterminée desdits conducteurs (24) de contact, et au moins une ou plusieurs configurations de dépôts conducteurs (27) formées autour desdites ouvertures, traversantes (21) de façon à être reliées auxdits conducteurs (24) de contact au moyen de fils métalliques (30); une série de microplaquettes semi-conductrices montées par un moyen adhésif sur une partie supérieure desdites ouvertures traversantes ménagées sur la partie centrale dudit substrat et incluant une série de pastilles de soudage (25); des fils métalliques (28) reliant électriquement des pastilles de soudage desdites microplaquettes auxdites configurations de dépôts conducteurs; et un boîtier (29), formant couvercle du substrat (22), assemblé à l'aide de moyens d'assemblage afin d'exposer lesdits conducteurs (24) de contacts extérieurs dudit substrat et de protéger lesdits fils et lesdites microplaquettes semi-conductrices en les recouvrant. |
| format | Patent |
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L'invention concerne une douille d'essais (20) comprenant: un substrat (22) incluant des conducteurs (24) de contacts extérieurs qui viennent en contact avec une carte extérieure d'essais de déverminage à une première extrémité latérale de ladite douille d'essais, une série d'ouvertures traversantes (21) situées à une distance prédéterminée desdits conducteurs (24) de contact, et au moins une ou plusieurs configurations de dépôts conducteurs (27) formées autour desdites ouvertures, traversantes (21) de façon à être reliées auxdits conducteurs (24) de contact au moyen de fils métalliques (30); une série de microplaquettes semi-conductrices montées par un moyen adhésif sur une partie supérieure desdites ouvertures traversantes ménagées sur la partie centrale dudit substrat et incluant une série de pastilles de soudage (25); des fils métalliques (28) reliant électriquement des pastilles de soudage desdites microplaquettes auxdites configurations de dépôts conducteurs; et un boîtier (29), formant couvercle du substrat (22), assemblé à l'aide de moyens d'assemblage afin d'exposer lesdits conducteurs (24) de contacts extérieurs dudit substrat et de protéger lesdits fils et lesdites microplaquettes semi-conductrices en les recouvrant.</description><edition>6</edition><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CURRENT COLLECTORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950127&DB=EPODOC&CC=FR&NR=2708106A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950127&DB=EPODOC&CC=FR&NR=2708106A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HYUN IN HO</creatorcontrib><creatorcontrib>KIM IL UNG</creatorcontrib><creatorcontrib>LEE SANG HYEOG</creatorcontrib><title>Test socket and method of producing microchips identified as serviceable by using this socket</title><description>The invention relates to a test socket (20) comprising: a substrate (22) including conductors (24) having external contacts which come into contact with an external burn-in (debugging) test card at a first lateral end of the said test socket, a series of through openings (21) situated at a predetermined distance from the said contact conductors (24), and at least one or more configurations of conducting depositions (27) formed around the said through openings (21) so as to be linked to the said contact conductors (24) by means of metal wires (30); a series of semiconducting microchips mounted using an adhesive means on an upper part of the said through openings formed in the central part of the said substrate and includng a series of solder beads (25); metal wires (28) electrically linking solder beads of the said microchips to the said configurations of conducting depositions; and a housing (29), forming a cover for the substrate (22), assembled with the aid of assembling means so as to expose the said external contact conductors (24) of the said substrate and to protect the said wires and the said semiconductor microchips by covering them.
L'invention concerne une douille d'essais (20) comprenant: un substrat (22) incluant des conducteurs (24) de contacts extérieurs qui viennent en contact avec une carte extérieure d'essais de déverminage à une première extrémité latérale de ladite douille d'essais, une série d'ouvertures traversantes (21) situées à une distance prédéterminée desdits conducteurs (24) de contact, et au moins une ou plusieurs configurations de dépôts conducteurs (27) formées autour desdites ouvertures, traversantes (21) de façon à être reliées auxdits conducteurs (24) de contact au moyen de fils métalliques (30); une série de microplaquettes semi-conductrices montées par un moyen adhésif sur une partie supérieure desdites ouvertures traversantes ménagées sur la partie centrale dudit substrat et incluant une série de pastilles de soudage (25); des fils métalliques (28) reliant électriquement des pastilles de soudage desdites microplaquettes auxdites configurations de dépôts conducteurs; et un boîtier (29), formant couvercle du substrat (22), assemblé à l'aide de moyens d'assemblage afin d'exposer lesdits conducteurs (24) de contacts extérieurs dudit substrat et de protéger lesdits fils et lesdites microplaquettes semi-conductrices en les recouvrant.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzEEKwjAQRuFsXIh6h7mA0CqoWxGLa-lWSpr8MYNtEjKp4O1F6AFcvc3HW6pHCykk0bxQSAdLI4qPlqKjlKOdDIcnjWxyNJ6TEFuEwo5hSQsJ8psNdD-A-g9N8tPFs8zHtVo4PQg2c1eKmmt7uW2RYgdJ2iCgdM19d6xOdXU41_s_yBeFfTvg</recordid><startdate>19950127</startdate><enddate>19950127</enddate><creator>HYUN IN HO</creator><creator>KIM IL UNG</creator><creator>LEE SANG HYEOG</creator><scope>EVB</scope></search><sort><creationdate>19950127</creationdate><title>Test socket and method of producing microchips identified as serviceable by using this socket</title><author>HYUN IN HO ; KIM IL UNG ; LEE SANG HYEOG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FR2708106A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>1995</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HYUN IN HO</creatorcontrib><creatorcontrib>KIM IL UNG</creatorcontrib><creatorcontrib>LEE SANG HYEOG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HYUN IN HO</au><au>KIM IL UNG</au><au>LEE SANG HYEOG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Test socket and method of producing microchips identified as serviceable by using this socket</title><date>1995-01-27</date><risdate>1995</risdate><abstract>The invention relates to a test socket (20) comprising: a substrate (22) including conductors (24) having external contacts which come into contact with an external burn-in (debugging) test card at a first lateral end of the said test socket, a series of through openings (21) situated at a predetermined distance from the said contact conductors (24), and at least one or more configurations of conducting depositions (27) formed around the said through openings (21) so as to be linked to the said contact conductors (24) by means of metal wires (30); a series of semiconducting microchips mounted using an adhesive means on an upper part of the said through openings formed in the central part of the said substrate and includng a series of solder beads (25); metal wires (28) electrically linking solder beads of the said microchips to the said configurations of conducting depositions; and a housing (29), forming a cover for the substrate (22), assembled with the aid of assembling means so as to expose the said external contact conductors (24) of the said substrate and to protect the said wires and the said semiconductor microchips by covering them.
L'invention concerne une douille d'essais (20) comprenant: un substrat (22) incluant des conducteurs (24) de contacts extérieurs qui viennent en contact avec une carte extérieure d'essais de déverminage à une première extrémité latérale de ladite douille d'essais, une série d'ouvertures traversantes (21) situées à une distance prédéterminée desdits conducteurs (24) de contact, et au moins une ou plusieurs configurations de dépôts conducteurs (27) formées autour desdites ouvertures, traversantes (21) de façon à être reliées auxdits conducteurs (24) de contact au moyen de fils métalliques (30); une série de microplaquettes semi-conductrices montées par un moyen adhésif sur une partie supérieure desdites ouvertures traversantes ménagées sur la partie centrale dudit substrat et incluant une série de pastilles de soudage (25); des fils métalliques (28) reliant électriquement des pastilles de soudage desdites microplaquettes auxdites configurations de dépôts conducteurs; et un boîtier (29), formant couvercle du substrat (22), assemblé à l'aide de moyens d'assemblage afin d'exposer lesdits conducteurs (24) de contacts extérieurs dudit substrat et de protéger lesdits fils et lesdites microplaquettes semi-conductrices en les recouvrant.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | Test socket and method of producing microchips identified as serviceable by using this socket |
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