Process and means for grasping and conveying silicon wafers
Technical field of semiconductors. The process is characterised in that the automatic conveying is carried out in boats D, of wafers A carrying the integrated circuits which are in the baskets C and vice versa, by using carrying or grasping means which come into contact with the cut face of each waf...
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| creator | HENRY REY-HERME |
| description | Technical field of semiconductors. The process is characterised in that the automatic conveying is carried out in boats D, of wafers A carrying the integrated circuits which are in the baskets C and vice versa, by using carrying or grasping means which come into contact with the cut face of each wafer A; the wafers thus taken or carried are then conveyed from the notch(es) of the basket as far as the corresponding notch(es) of the boat, and vice versa. The invention applies especially to the handling of integrated circuit wafers.
L'OBJET DE L'INVENTION SE RATTACHE AU SECTEUR TECHNIQUE DES SEMI-CONDUCTEURS.LE PROCEDE EST REMARQUABLE EN CE QUE L'ON OPERE LE TRANSFERT AUTOMATIQUE DANS DES NACELLESD, DES PLAQUETTESA PORTANT LES CIRCUITS INTEGRES QUI SE TROUVENT DANS LES PANIERSC, ET INVERSEMENT, EN METTANT EN OEUVRE DES MOYENS PORTEURS OU PREHENSEURS QUI VIENNENT EN CONTACT SUR LA TRANCHE DE CHAQUE PLAQUETTEA; ON TRANSPORTE ENSUITE LA OU LES PLAQUETTES AINSI PRISES OU PORTEES DEPUIS LA OU LES ENCOCHES DU PANIER JUSQU'A LA OU AUX ENCOCHES CORRESPONDANTES DE LA NACELLE, ET INVERSEMENT.L'INVENTION S'APPLIQUE NOTAMMENT A LA MANIPULATION DES PLAQUETTES DE CIRCUITS INTEGRES. |
| format | Patent |
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L'OBJET DE L'INVENTION SE RATTACHE AU SECTEUR TECHNIQUE DES SEMI-CONDUCTEURS.LE PROCEDE EST REMARQUABLE EN CE QUE L'ON OPERE LE TRANSFERT AUTOMATIQUE DANS DES NACELLESD, DES PLAQUETTESA PORTANT LES CIRCUITS INTEGRES QUI SE TROUVENT DANS LES PANIERSC, ET INVERSEMENT, EN METTANT EN OEUVRE DES MOYENS PORTEURS OU PREHENSEURS QUI VIENNENT EN CONTACT SUR LA TRANCHE DE CHAQUE PLAQUETTEA; ON TRANSPORTE ENSUITE LA OU LES PLAQUETTES AINSI PRISES OU PORTEES DEPUIS LA OU LES ENCOCHES DU PANIER JUSQU'A LA OU AUX ENCOCHES CORRESPONDANTES DE LA NACELLE, ET INVERSEMENT.L'INVENTION S'APPLIQUE NOTAMMENT A LA MANIPULATION DES PLAQUETTES DE CIRCUITS INTEGRES.</description><edition>4</edition><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1986</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19860110&DB=EPODOC&CC=FR&NR=2567160A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19860110&DB=EPODOC&CC=FR&NR=2567160A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HENRY REY-HERME</creatorcontrib><title>Process and means for grasping and conveying silicon wafers</title><description>Technical field of semiconductors. The process is characterised in that the automatic conveying is carried out in boats D, of wafers A carrying the integrated circuits which are in the baskets C and vice versa, by using carrying or grasping means which come into contact with the cut face of each wafer A; the wafers thus taken or carried are then conveyed from the notch(es) of the basket as far as the corresponding notch(es) of the boat, and vice versa. The invention applies especially to the handling of integrated circuit wafers.
L'OBJET DE L'INVENTION SE RATTACHE AU SECTEUR TECHNIQUE DES SEMI-CONDUCTEURS.LE PROCEDE EST REMARQUABLE EN CE QUE L'ON OPERE LE TRANSFERT AUTOMATIQUE DANS DES NACELLESD, DES PLAQUETTESA PORTANT LES CIRCUITS INTEGRES QUI SE TROUVENT DANS LES PANIERSC, ET INVERSEMENT, EN METTANT EN OEUVRE DES MOYENS PORTEURS OU PREHENSEURS QUI VIENNENT EN CONTACT SUR LA TRANCHE DE CHAQUE PLAQUETTEA; ON TRANSPORTE ENSUITE LA OU LES PLAQUETTES AINSI PRISES OU PORTEES DEPUIS LA OU LES ENCOCHES DU PANIER JUSQU'A LA OU AUX ENCOCHES CORRESPONDANTES DE LA NACELLE, ET INVERSEMENT.L'INVENTION S'APPLIQUE NOTAMMENT A LA MANIPULATION DES PLAQUETTES DE CIRCUITS INTEGRES.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1986</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAOKMpPTi0uVkjMS1HITU3MK1ZIyy9SSC9KLC7IzEsHCyfn55WlVoJ4xZk5mUCeQnliWmpRMQ8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiXcLMjI1Mzc0M3A0NCZCCQBM8S8M</recordid><startdate>19860110</startdate><enddate>19860110</enddate><creator>HENRY REY-HERME</creator><scope>EVB</scope></search><sort><creationdate>19860110</creationdate><title>Process and means for grasping and conveying silicon wafers</title><author>HENRY REY-HERME</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FR2567160A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>1986</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HENRY REY-HERME</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HENRY REY-HERME</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Process and means for grasping and conveying silicon wafers</title><date>1986-01-10</date><risdate>1986</risdate><abstract>Technical field of semiconductors. The process is characterised in that the automatic conveying is carried out in boats D, of wafers A carrying the integrated circuits which are in the baskets C and vice versa, by using carrying or grasping means which come into contact with the cut face of each wafer A; the wafers thus taken or carried are then conveyed from the notch(es) of the basket as far as the corresponding notch(es) of the boat, and vice versa. The invention applies especially to the handling of integrated circuit wafers.
L'OBJET DE L'INVENTION SE RATTACHE AU SECTEUR TECHNIQUE DES SEMI-CONDUCTEURS.LE PROCEDE EST REMARQUABLE EN CE QUE L'ON OPERE LE TRANSFERT AUTOMATIQUE DANS DES NACELLESD, DES PLAQUETTESA PORTANT LES CIRCUITS INTEGRES QUI SE TROUVENT DANS LES PANIERSC, ET INVERSEMENT, EN METTANT EN OEUVRE DES MOYENS PORTEURS OU PREHENSEURS QUI VIENNENT EN CONTACT SUR LA TRANCHE DE CHAQUE PLAQUETTEA; ON TRANSPORTE ENSUITE LA OU LES PLAQUETTES AINSI PRISES OU PORTEES DEPUIS LA OU LES ENCOCHES DU PANIER JUSQU'A LA OU AUX ENCOCHES CORRESPONDANTES DE LA NACELLE, ET INVERSEMENT.L'INVENTION S'APPLIQUE NOTAMMENT A LA MANIPULATION DES PLAQUETTES DE CIRCUITS INTEGRES.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Process and means for grasping and conveying silicon wafers |
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