Thermo-compression diffusion bonding press - esp. for joining copper heat sink to metal foil when mfg. high power semiconductor devices

Thermocompression diffusion bonding press consists of one upper plate (a) and pressure pad (b) made of metal with a prescribed coefft. of thermal expansion (CTE); and a lower plate (c) made of metal with a prescribed CTE and parallel with elements (a, b). Threaded bolts are employed to hold the asse...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	DOUGLAS EUGENE HOUSTON
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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