LIGNINBASERADE LIM
Novel adhesives for wood composites are described. The adhesives comprise a novel combination of an organosolv lignin and a phenol-formaldehyde resin in a weight ratio of from about 0.5:99.5 to about 70:30 based on the phenolic solids in said phenol-formaldehyde resin. The adhesives further comprise...
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| creator | WU, CHIH FAE ASH, JACOB LORA, JAIRO H CREAMER, ALBERT W |
| description | Novel adhesives for wood composites are described. The adhesives comprise a novel combination of an organosolv lignin and a phenol-formaldehyde resin in a weight ratio of from about 0.5:99.5 to about 70:30 based on the phenolic solids in said phenol-formaldehyde resin. The adhesives further comprise a modifier which improves the performance of the adhesive. Adhesives comprising an organosolv lignin and a liquid phenol-formaldehyde resin are also described. The organosolv lignin solution is comprised in either an alkaline solution or in a dispersion. Adhesives wherein the organosolv lignin is phenolated or methylolated prior to incorporation with the phenol-formaldehyde resin are also described. Wood composites such as plywood, waferboards and oriented strandboards were manufactured using the adhesives of the invention. Results of board testing demonstrate that the wood composites of the invention are competitive with wood composites manufactured using commercial adhesives. |
| format | Patent |
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The adhesives comprise a novel combination of an organosolv lignin and a phenol-formaldehyde resin in a weight ratio of from about 0.5:99.5 to about 70:30 based on the phenolic solids in said phenol-formaldehyde resin. The adhesives further comprise a modifier which improves the performance of the adhesive. Adhesives comprising an organosolv lignin and a liquid phenol-formaldehyde resin are also described. The organosolv lignin solution is comprised in either an alkaline solution or in a dispersion. Adhesives wherein the organosolv lignin is phenolated or methylolated prior to incorporation with the phenol-formaldehyde resin are also described. Wood composites such as plywood, waferboards and oriented strandboards were manufactured using the adhesives of the invention. Results of board testing demonstrate that the wood composites of the invention are competitive with wood composites manufactured using commercial adhesives.</description><language>fin</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931006&DB=EPODOC&CC=FI&NR=934392A0$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931006&DB=EPODOC&CC=FI&NR=934392A0$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WU, CHIH FAE</creatorcontrib><creatorcontrib>ASH, JACOB</creatorcontrib><creatorcontrib>LORA, JAIRO H</creatorcontrib><creatorcontrib>CREAMER, ALBERT W</creatorcontrib><title>LIGNINBASERADE LIM</title><description>Novel adhesives for wood composites are described. The adhesives comprise a novel combination of an organosolv lignin and a phenol-formaldehyde resin in a weight ratio of from about 0.5:99.5 to about 70:30 based on the phenolic solids in said phenol-formaldehyde resin. The adhesives further comprise a modifier which improves the performance of the adhesive. Adhesives comprising an organosolv lignin and a liquid phenol-formaldehyde resin are also described. The organosolv lignin solution is comprised in either an alkaline solution or in a dispersion. Adhesives wherein the organosolv lignin is phenolated or methylolated prior to incorporation with the phenol-formaldehyde resin are also described. Wood composites such as plywood, waferboards and oriented strandboards were manufactured using the adhesives of the invention. Results of board testing demonstrate that the wood composites of the invention are competitive with wood composites manufactured using commercial adhesives.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDy8XT38_Rzcgx2DXJ0cVXw8fTlYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXxbp6WxibGlkaOBsaEVQAAxQ0dJw</recordid><startdate>19931006</startdate><enddate>19931006</enddate><creator>WU, CHIH FAE</creator><creator>ASH, JACOB</creator><creator>LORA, JAIRO H</creator><creator>CREAMER, ALBERT W</creator><scope>EVB</scope></search><sort><creationdate>19931006</creationdate><title>LIGNINBASERADE LIM</title><author>WU, CHIH FAE ; ASH, JACOB ; LORA, JAIRO H ; CREAMER, ALBERT W</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FI934392A03</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>fin</language><creationdate>1993</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>WU, CHIH FAE</creatorcontrib><creatorcontrib>ASH, JACOB</creatorcontrib><creatorcontrib>LORA, JAIRO H</creatorcontrib><creatorcontrib>CREAMER, ALBERT W</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WU, CHIH FAE</au><au>ASH, JACOB</au><au>LORA, JAIRO H</au><au>CREAMER, ALBERT W</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LIGNINBASERADE LIM</title><date>1993-10-06</date><risdate>1993</risdate><abstract>Novel adhesives for wood composites are described. The adhesives comprise a novel combination of an organosolv lignin and a phenol-formaldehyde resin in a weight ratio of from about 0.5:99.5 to about 70:30 based on the phenolic solids in said phenol-formaldehyde resin. The adhesives further comprise a modifier which improves the performance of the adhesive. Adhesives comprising an organosolv lignin and a liquid phenol-formaldehyde resin are also described. The organosolv lignin solution is comprised in either an alkaline solution or in a dispersion. Adhesives wherein the organosolv lignin is phenolated or methylolated prior to incorporation with the phenol-formaldehyde resin are also described. Wood composites such as plywood, waferboards and oriented strandboards were manufactured using the adhesives of the invention. Results of board testing demonstrate that the wood composites of the invention are competitive with wood composites manufactured using commercial adhesives.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | LIGNINBASERADE LIM |
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