BINDEMEDEL OCH FOERFARANDE FOER FRAMSTAELLNING AV DETSAMMA

The adhesive for producing plywood boards, chipboards and fibreboards and the like, which contains, as main components, phenol formaldehyde resin and lignin derivatives fractionated according to molecular weight, does not, as in the main patent, need to contain only those lignin derivatives of which...

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Bibliographische Detailangaben
Hauptverfasser:	FUHRMANN AGNETE G M, FORSS KAJ G
Format:	Patent
Sprache:	fin
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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