Menetelmä ja järjestely käsittäen piirilevyn

Menetelmä ja järjestely käsittäen piirilevyn

A method of integrating a printed wiring board (PWB) into a plastic item, and an arrangement. The arrangement comprises a printed wiring board (PWB) and soft thermoplastic (2) attached to a first side (3) of the PWB (1) and on at least some locations of edges (4) of the PWB (1). The soft thermoplast...

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Hauptverfasser: MUUKKONEN,ESA, TIAN,DEWEI, SILVENNOINEN,MIKKO
Format: Patent
Sprache:fin ; swe
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator MUUKKONEN,ESA
TIAN,DEWEI
SILVENNOINEN,MIKKO
description A method of integrating a printed wiring board (PWB) into a plastic item, and an arrangement. The arrangement comprises a printed wiring board (PWB) and soft thermoplastic (2) attached to a first side (3) of the PWB (1) and on at least some locations of edges (4) of the PWB (1). The soft thermoplastic (2) establishes a first interface (5) at or underneath the plane (7) of a second side (6) of the PWB (1). The hard thermoplastic (8) forms a second interface (9) with the second side (6) of the PWB (1), the hard thermoplastic (8) being unattached to the PWB (1) but adhered to the soft thermoplastic (2) at the first interface (5).
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language fin ; swe
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Menetelmä ja järjestely käsittäen piirilevyn
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