Jäähdytyselementti
The present invention relates to a cooling element (1) of an electronic device, comprising: an inlet opening (2), and outlet opening (3), and a flow channel (4, 5, 6, 7, 8). To achieve efficient cooling with as low costs as possible, the flow channel (7) is designed to cause a pressure difference be...
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| creator | LAURILA,RISTO SIKANEN,JUKKA UKKOLA,ERKKI |
| description | The present invention relates to a cooling element (1) of an electronic device, comprising: an inlet opening (2), and outlet opening (3), and a flow channel (4, 5, 6, 7, 8). To achieve efficient cooling with as low costs as possible, the flow channel (7) is designed to cause a pressure difference between the forward end (4) and tail end (6) of the flow channel. At the higher-pressure forward end (4), an inlet opening (10) is arranged for a secondary cycle (11). At the lower-pressure tail end (6) of the cooling element (1) flow channel, an outlet opening (12) is arranged for said secondary cycle (11). |
| format | Patent |
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To achieve efficient cooling with as low costs as possible, the flow channel (7) is designed to cause a pressure difference between the forward end (4) and tail end (6) of the flow channel. At the higher-pressure forward end (4), an inlet opening (10) is arranged for a secondary cycle (11). At the lower-pressure tail end (6) of the cooling element (1) flow channel, an outlet opening (12) is arranged for said secondary cycle (11).</description><edition>7</edition><language>fin ; swe</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20051212&DB=EPODOC&CC=FI&NR=20045216A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20051212&DB=EPODOC&CC=FI&NR=20045216A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LAURILA,RISTO</creatorcontrib><creatorcontrib>SIKANEN,JUKKA</creatorcontrib><creatorcontrib>UKKOLA,ERKKI</creatorcontrib><title>Jäähdytyselementti</title><description>The present invention relates to a cooling element (1) of an electronic device, comprising: an inlet opening (2), and outlet opening (3), and a flow channel (4, 5, 6, 7, 8). To achieve efficient cooling with as low costs as possible, the flow channel (7) is designed to cause a pressure difference between the forward end (4) and tail end (6) of the flow channel. At the higher-pressure forward end (4), an inlet opening (10) is arranged for a secondary cycle (11). At the lower-pressure tail end (6) of the cooling element (1) flow channel, an outlet opening (12) is arranged for said secondary cycle (11).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDxOrzk8JKMlMqSyuLUnNTc1LySkkweBta0xJziVF4ozc2g4OYa4uyhm1qQH59aXJCYnJqXWhLv5mlkYGBiamRo5mhMhBIAu9oiAQ</recordid><startdate>20051212</startdate><enddate>20051212</enddate><creator>LAURILA,RISTO</creator><creator>SIKANEN,JUKKA</creator><creator>UKKOLA,ERKKI</creator><scope>EVB</scope></search><sort><creationdate>20051212</creationdate><title>Jäähdytyselementti</title><author>LAURILA,RISTO ; SIKANEN,JUKKA ; UKKOLA,ERKKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_FI20045216A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>fin ; swe</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LAURILA,RISTO</creatorcontrib><creatorcontrib>SIKANEN,JUKKA</creatorcontrib><creatorcontrib>UKKOLA,ERKKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LAURILA,RISTO</au><au>SIKANEN,JUKKA</au><au>UKKOLA,ERKKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Jäähdytyselementti</title><date>2005-12-12</date><risdate>2005</risdate><abstract>The present invention relates to a cooling element (1) of an electronic device, comprising: an inlet opening (2), and outlet opening (3), and a flow channel (4, 5, 6, 7, 8). To achieve efficient cooling with as low costs as possible, the flow channel (7) is designed to cause a pressure difference between the forward end (4) and tail end (6) of the flow channel. At the higher-pressure forward end (4), an inlet opening (10) is arranged for a secondary cycle (11). At the lower-pressure tail end (6) of the cooling element (1) flow channel, an outlet opening (12) is arranged for said secondary cycle (11).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | fin ; swe |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Jäähdytyselementti |
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